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1. (WO2016180671) MULTILAYER ADHESIVE BOND
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/180671    International Application No.:    PCT/EP2016/059852
Publication Date: 17.11.2016 International Filing Date: 03.05.2016
IPC:
C04B 35/628 (2006.01), B32B 9/00 (2006.01), B32B 15/04 (2006.01), B32B 15/20 (2006.01), C04B 37/02 (2006.01), H05K 1/02 (2006.01), H05K 3/00 (2006.01), H05K 3/38 (2006.01), B32B 15/08 (2006.01), B32B 27/28 (2006.01), B32B 27/38 (2006.01)
Applicants: ROGERS GERMANY GMBH [DE/DE]; Am Stadtwald 2 92676 Eschenbach (DE)
Inventors: TANG, Xinhe; (DE)
Agent: MÜLLER, F. Peter; (DE)
Priority Data:
10 2015 107 223.8 08.05.2015 DE
Title (EN) MULTILAYER ADHESIVE BOND
(FR) LIAISON ADHÉSIVE MULTICOUCHE
Abstract: front page image
(EN)Adhesive bond for bonding a composite material, in particular for circuit boards, consisting of a ceramic and a metallized layer to be bonded to the ceramic, wherein the adhesive bond has at least two layers (10, 20) and wherein a first layer (10) has an adhesive based on polyimide or based on epoxy and a second layer (20) has an adhesive based on epoxy or based on polyimide.
(FR)Cette invention concerne une liaison adhésive permettant de lier un matériau composite, en particulier pour cartes de circuit, constitué d'une céramique et d'une couche métallisée destinée à être liée à la céramique, la liaison adhésive comportant au moins deux couches (10, 20) dont une première couche (10) qui contient un adhésif à base d'un polyimide ou à base d'un époxy et une seconde couche (20) contenant un adhésif à base d'un époxy ou à base d'un polyimide. [Fig. 1]
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)