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1. (WO2016177252) PACKAGING METHOD OF OLED DEVICE, PACKAGING STRUCTURE AND DISPLAY APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/177252    International Application No.:    PCT/CN2016/078848
Publication Date: 10.11.2016 International Filing Date: 08.04.2016
IPC:
H01L 51/52 (2006.01), H01L 51/56 (2006.01)
Applicants: BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; No. 10 Jiuxianqiao Rd., Chaoyang District Beijing 100015 (CN)
Inventors: YU, Donghui; (CN).
WANG, Chun Jan; (CN)
Agent: LIU, SHEN & ASSOCIATES; 10th Floor, Building 1 10 Caihefang Road, Haidian District Beijing 100080 (CN)
Priority Data:
201510229716.3 07.05.2015 CN
Title (EN) PACKAGING METHOD OF OLED DEVICE, PACKAGING STRUCTURE AND DISPLAY APPARATUS
(FR) PROCÉDÉ D'ENCAPSULATION DE DISPOSITIF OLED, STRUCTURE D'ENCAPSULATION ET APPAREIL D'AFFICHAGE
(ZH) OLED器件的封装方法及封装结构、显示装置
Abstract: front page image
(EN)A packaging method of an OLED device (12), a packaging structure and a display apparatus. The packaging method of the OLED device (12) comprises the following steps: providing a substrate base plate (11) having the OLED device (12); forming a passivation layer (13) on the surface of the OLED device (12); and forming a passivation reinforcement layer (14) on the edge region of the passivation layer (13).
(FR)L'invention concerne un procédé d'encapsulation d'un dispositif à diodes électroluminescentes organiques (OLED) (12), une structure d'encapsulation et un appareil d'affichage. Le procédé d'encapsulation du dispositif OLED (12) comprend les étapes suivantes : production d'une plaque de base de substrat (11) portant le dispositif OLED (12) ; formation d'une couche de passivation (13) sur la surface du dispositif OLED (12) ; et formation d'une couche de renforcement de passivation (14) sur la zone du bord de la couche de passivation (13).
(ZH)一种OLED器件(12)的封装方法及封装结构、显示装置。该OLED器件(12)的封装方法包括:提供一形成有OLED器件(12)的衬底基板(11);在该OLED器件(12)的表面形成至少一层钝化层(13);在该至少一层钝化层(13)的边缘区域形成至少一层钝化加固层(14)。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)