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Machine translation
1. (WO2016175530) MOVABLE LASER ENGRAVING AND CUTTING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/175530    International Application No.:    PCT/KR2016/004328
Publication Date: 03.11.2016 International Filing Date: 26.04.2016
IPC:
B23K 26/38 (2006.01), B23K 26/02 (2006.01), B23K 26/70 (2014.01)
Applicants: HANSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION [KR/KR]; (Hanseo University) 46, Hanseo 1-ro, Haemi-myeon Seosan-si Chungcheongnam-do 31962 (KR).
WOO, Choong Chae [KR/KR]; (KR)
Inventors: WOO, Choong Chae; (KR)
Agent: NA, Sun Kyoon; (KR)
Priority Data:
10-2015-0059229 27.04.2015 KR
10-2015-0059234 27.04.2015 KR
Title (EN) MOVABLE LASER ENGRAVING AND CUTTING DEVICE
(FR) DISPOSITIF DE COUPE ET DE GRAVURE AU LASER MOBILE
(KO) 이동식 레이저 각인 절단 장치
Abstract: front page image
(EN)The present invention relates to a movable laser engraving and cutting device and, more specifically, to a freely moving movable laser engraving and cutting device, which can engrave and cut materials having various sizes or shapes since a laser can be irradiated to the outside of a lower frame. According to the present invention, the objective of the laser engraving and cutting device is to: enable engraving or cutting by opening the lower part of the device even if the material to be engraved or cut exceeds the size of the laser engraving and cutting device; and enable movement by minimizing the volume of the laser engraving and cutting device.
(FR)La présente invention concerne un dispositif de coupe et de gravure au laser mobile et, plus particulièrement, un dispositif de coupe et de gravure au laser mobile se déplaçant librement, qui peut graver et couper des matériaux ayant diverses tailles ou formes étant donné qu'un laser peut être irradié vers l'extérieur d'un cadre inférieur. Selon la présente invention, le dispositif de coupe et de gravure au laser a pour but : de permettre une gravure ou une coupe par ouverture de la partie inférieure du dispositif même si le matériau à graver ou à couper dépasse la taille du dispositif de coupe et de gravure au laser; de permettre un mouvement en réduisant à un minimum le volume du dispositif de coupe et de gravure au laser.
(KO)본 발명은 이동식 레이저 각인 절단 장치에 관한 것으로, 보다 상세하게는 레이저가 하단의 프레임 외부로 조사하는 것이 가능하여 다양한 크기 또는 형태를 가지는 재료에 대한 각인 및 절단이 가능하고, 이동이 자유로운 이동식 레이저 각인 절단 장치에 관한 것이다. 본 발명에 의거한 레이저 각인 절단 장치는 장치의 하부를 개방하여 각인 또는 절단할 재료가 레이저 각인 절단 장치의 크기를 벗어나는 경우에도 각인 또는 절단이 가능하도록 하고, 레이저 각인 절단 장치의 부피를 최소화하여 이동이 가능하도록 하는 것을 목적으로 한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)