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1. (WO2016175085) ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/175085    International Application No.:    PCT/JP2016/062367
Publication Date: 03.11.2016 International Filing Date: 19.04.2016
IPC:
G06K 19/077 (2006.01), B42D 25/305 (2014.01)
Applicants: TOPPAN FORMS CO., LTD. [JP/JP]; 1-7-3, Higashi-Shimbashi, Minato-ku, Tokyo 1058311 (JP)
Inventors: KAGAYA Hitoshi; (JP).
YOSHINO Satomi; (JP).
MIZUNUMA Yoshihiro; (JP)
Agent: SHIGA Masatake; (JP)
Priority Data:
2015-092327 28.04.2015 JP
Title (EN) ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
(FR) DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 電子機器およびその製造方法
Abstract: front page image
(EN)This electronic device (10) is provided with: an inlet (1) having a hard substrate (11); a first covering member (2) that covers a first surface (11a) of the hard substrate (11); a reinforcing plate (3) that is harder than the hard substrate (11) and is provided on a second surface (11b) of the hard substrate (11) so as to cover a recess (23) when viewed in plan; and a second covering member (4) that is formed by injection molding so as to cover the second surface (11b) of the hard substrate (11).
(FR)L'invention concerne un dispositif électronique (10) muni d'une admission (1) qui possède un substrat dur (11); d'un premier élément de recouvrement (2) qui recouvre une première surface (11a) du substrat dur (11); d'une plaque de renfort (3) qui est plus dure que le substrat dur (11) et qui est prévue sur une seconde surface (11b) du substrat dur (11) de manière à recouvrir un évidement (23) lorsqu'on regarde de dessus; et d'un second élément de recouvrement (4) qui est formé par moulage par injection de manière à recouvrir la seconde surface (11b) du substrat dur (11).
(JA)本発明の電子機器(10)は、硬質基板(11)を有するインレット(1)と、硬質基板(11)の第一面(11a)を覆う第一被覆部材(2)と、硬質基板(11)の第二面(11b)に設けられて平面視において凹部(23)を覆う、硬質基板(11)よりも硬質な補強板(3)と、硬質基板(11)の第二面(11b)を覆うようにインジェクション成形によって形成された第二被覆部材(4)とを備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)