WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2016175001) HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/175001    International Application No.:    PCT/JP2016/061248
Publication Date: 03.11.2016 International Filing Date: 06.04.2016
IPC:
C08L 83/04 (2006.01), C08K 3/08 (2006.01), C08K 3/22 (2006.01), C08K 3/28 (2006.01), C08L 63/00 (2006.01), C09K 5/14 (2006.01), C10M 107/24 (2006.01), C10M 107/50 (2006.01), C10M 125/04 (2006.01), C10M 125/10 (2006.01), C10M 125/20 (2006.01), C10M 125/26 (2006.01), C10N 10/02 (2006.01), C10N 10/04 (2006.01), C10N 10/06 (2006.01), C10N 10/08 (2006.01), C10N 10/16 (2006.01), C10N 20/00 (2006.01), C10N 20/02 (2006.01), C10N 20/06 (2006.01), C10N 30/00 (2006.01), C10N 30/02 (2006.01), C10N 40/00 (2006.01), C10N 50/10 (2006.01)
Applicants: SHIN-ETSU CHEMICAL CO., LTD. [JP/JP]; 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004 (JP)
Inventors: ICHIROKU Nobuhiro; (JP)
Agent: PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061 (JP)
Priority Data:
2015-092709 30.04.2015 JP
Title (EN) HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION
(FR) COMPOSITION DE GRAISSE DE SILICONE THERMOCONDUCTRICE
(JA) 熱伝導性シリコーングリース組成物
Abstract: front page image
(EN)A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 μm in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B) > (A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000Pa·s at 25ºC.
(FR)L’invention concerne une composition de graisse de silicone thermoconductrice comprenant (A) un organopolysiloxane dans une quantité de 20 à 90 parties en masse, (B) un composé organique de type non silicone dans une quantité de 80 à 10 parties en masse (la quantité totale des constituants (A) et (B) étant de 100 parties en masse) et (C) une charge minérale thermoconductrice ayant un diamètre moyen de particule de 0,5 à 100 µm dans une quantité de 200 à 2 000 parties en masse par rapport à 100 parties en masse de la quantité totale des constituants (A) et (B), la valeur SP du composé organique de type non silicone (B) étant supérieure à celle de l'organopolysiloxane (A) (c'est-à-dire, (B) > (A)), la valeur obtenue en soustrayant la valeur SP du constituant (A) de la valeur SP du constituant (B) est supérieure à 2, et la viscosité de la composition de graisse de silicone thermoconductrice est de 50 à 1 000 Pa·s à 25 °C.
(JA)(A)オルガノポリシロキサン:20~90質量部、 (B)非シリコーン系有機化合物:80~10質量部、 (但し、(A)、(B)成分の合計は100質量部) (C)平均粒径が0.5~100μmである熱伝導性無機充填材:(A)、(B)成分の合計100質量部に対して200~2,000質量部 を含有してなる熱伝導性シリコーングリース組成物であって、オルガノポリシロキサン(A)と非シリコーン系有機化合物(B)のSP値が(B)>(A)であると共に、(B)成分のSP値-(A)成分のSP値>2であり、かつ熱伝導性シリコーングリース組成物の粘度が25℃において50~1,000Pa・sである熱伝導性シリコーングリース組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)