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1. WO2016174966 - BUNDLED WIRE-LIKE MEMBER, BALL TRANSFER HEAD, BALL LOADING DEVICE, AND BALL LOADING METHOD

Publication Number WO/2016/174966
Publication Date 03.11.2016
International Application No. PCT/JP2016/059260
International Filing Date 23.03.2016
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
CPC
H01L 2021/60022
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
60007involving a soldering or an alloying process
60022using bump connectors, e.g. for flip chip mounting
H01L 24/742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
741Apparatus for manufacturing means for bonding, e.g. connectors
742Apparatus for manufacturing bump connectors
H01L 24/75
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
75Apparatus for connecting with bump connectors or layer connectors
H01L 24/81
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
Applicants
  • アスリートFA株式会社 ATHLETE FA CORPORATION [JP]/[JP]
Inventors
  • 矢沢 一郎 YAZAWA, Ichiro
  • 川上 茂明 KAWAKAMI, Shigeaki
Agents
  • アイアット国際特許業務法人 IAT WORLD PATENT LAW FIRM
Priority Data
2015-09001827.04.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) BUNDLED WIRE-LIKE MEMBER, BALL TRANSFER HEAD, BALL LOADING DEVICE, AND BALL LOADING METHOD
(FR) ÉLÉMENT DE TYPE FIL EN FAISCEAU, TÊTE DE TRANSFERT À BILLES, DISPOSITIF DE CHARGEMENT DE BILLES, ET PROCÉDÉ DE CHARGEMENT DE BILLES
(JA) 結束線状部材、ボール振込ヘッド、ボール搭載装置およびボール搭載方法
Abstract
(EN)
The purpose of the present invention is to provide a ball transfer head, a ball loading device, and a ball loading method that enable a conductive ball supplied onto a transfer mask to be more reliably moved. Provided is a ball transfer head 27 for transferring balls B to openings 17 using wire-like members 34, the balls having been supplied onto a transfer mask 16 configured so that the arrangement pattern of openings 17 thereon matches the arrangement pattern of electrodes T formed on a substrate P, wherein the present invention includes a bundled wire-like member 33 in which a plurality of twisted wires 35 formed by twisting a plurality of the wire-like members 34 are bundled at both ends of the twisted wires, and the bundled wire-like member 33 is twisted from one end to the other, and in that state, the balls B are transferred to the openings 17 by causing the bundled wire-like member 33 to move along the transfer mask 16.
(FR)
L'objet de la présente invention est de fournir une tête de transfert à billes, un dispositif de chargement de billes, et un procédé de chargement de billes qui permettent à une bille conductrice fournie sur un masque de transfert d'être déplacée de manière plus fiable. L'invention concerne une tête de transfert à billes 27 permettant de transférer des billes B vers des ouvertures 17 à l'aide d'éléments de type fil 34, les billes ayant été fournies sur un masque de transfert 16 conçu de telle sorte que le motif d'agencement des ouvertures 17 sur celui-ci correspond au motif d'agencement d'électrodes T formées sur un substrat P, la présente invention comprenant un élément de type fil en faisceau 33, une pluralité de fils torsadés 35 formés par torsion d'une pluralité d'éléments de type fil 34 étant regroupés au niveau des deux extrémités des fils torsadés, et l'élément de type fil en faisceau 33 étant torsadé d'une extrémité à l'autre, et dans cet état, les billes B étant transférées vers les ouvertures 17 en amenant l'élément de type fil en faisceau 33 à se déplacer le long du masque de transfert 16.
(JA)
振込マスク上に供給された導電ボールをより確実に移動することができる、ボール振込ヘッド、ボール搭載装置およびボール搭載方法を提供することを目的とする。 基板Pに形成された電極Tの配置パターンに開口17の配置パターンを一致させた振込マスク16上に供給されたボールBを線状部材34により開口17に振り込むボール振込ヘッド27において、複数本の線状部材34を撚って形成した撚線35が複数本その両端で束ねられた結束線状部材33を有し、結束線状部材33は、一端から他端に亘って捩じられた状態とされ、結束線状部材33を振込マスク16に沿わせて移動させることでボールBを開口17に振り込むこと。
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