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Machine translation
1. (WO2016174451) AN LED PACKAGE AND ARRAY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/174451    International Application No.:    PCT/GB2016/051224
Publication Date: 03.11.2016 International Filing Date: 28.04.2016
IPC:
H01L 33/60 (2010.01)
Applicants: LITECOOL LIMITED [GB/GB]; Cooper Building Sheffield Technology Park, Arundel Street Sheffield S1 2NS (GB)
Inventors: REEVES, James; (GB).
CORBIN, Robert; (GB).
WAKEFIELD, Elwyn; (GB)
Agent: THE IP ASSET PARTNERSHIP LIMITED; (GB)
Priority Data:
1507242.4 28.04.2015 GB
Title (EN) AN LED PACKAGE AND ARRAY
(FR) BOÎTIER ET MATRICE DE DEL
Abstract: front page image
(EN)A light emitting diode (LED) array (100) comprising a plurality of LED die packages (10), each LED die package (10) having at least one LED die (12),a first conductive component (14) and a second conductive component (16), each of the conductive components (14,16) are electrically connected to the at least one LED die,the first conductive component (14) includes at least one first electrical connecting feature (18), the second conductive component (16) includes at least one second electrical connecting feature (25),in which one or more of the at least one first (18) or second (25) electrical connecting features (25) directly engages with one of the at least one first (18)or second (25) electrical connecting features of an adjacent LED die package (10) to electrically connect the first (18) or second (25) electrical connecting feature to the first (18) or second (25) electrical connecting feature of the adjacent LED die package (10).
(FR)L'invention concerne une matrice de diodes électroluminescentes (DEL) (100) comprenant une pluralité de boîtiers de puce DEL (10), chaque boîtier de puce DEL (10) comportant au moins une puce d DEL (12), un premier composant conducteur (14) et un second composant conducteur (16), chacun des composants conducteurs (14,16) étant connecté électriquement à ladite puce DEL, le premier composant conducteur (14) comprenant au moins un premier élément de connexion électrique (18), le second composant conducteur (16) comprenant au moins un second élément de connexion électrique (25), un ou plusieurs du ou des premiers (18) ou seconds (25) éléments de connexion électrique étant directement en contact avec l'un du ou des premiers (18) ou seconds (25) éléments de connexion électrique d'un boîtier de puce DEL (10) adjacent afin de connecter électriquement le premier (18) ou second (25) élément de connexion électrique au premier (18) ou second (25) élément de connexion électrique du boîtier de puce DEL (10) adjacent.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)