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1. WO2016153971 - THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

WHAT IS CLAIMED IS:

1. A heat spreader, comprising:

a substrate;

a metallization layer structure disposed on at least one surface of the substrate, comprising:

a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; a heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer,

wherein the diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

2. The heat spreader recited in claim 1 wherein the thick film layer comprises silver and wherein the diffusion barrier layer inhibits silver in the thick film layer and the material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

3. The heat spreader recited in claim 1 wherein the heat conductive layer comprises copper and wherein the diffusion barrier layer inhibits material in the thick film layer and the copper in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

4. The heat spreader recited in claim 3 wherein the thick film layer comprises silver and wherein the diffusion barrier layer inhibits silver in the thick film layer and the copper in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

5. The heat spreader recited in claim 1 wherein the metallization layer structure is disposed on a plurality of sides of the substrate.

6. The heat spreader recited in claim 5 wherein the at least one surface is a horizontal surface and another surface is at least one vertical side of the substrate.

7. The heat spreader recited in claim 5 wherein the metallization layer structure is disposed on top and bottom surface of the substrate.

8. . The heat spreader recited in claim 5 wherein the metallization layer structure is disposed on a plurality of sides of the substrate.

9. The heat spreader recited in claim 6 wherein the metallization layer structure is disposed on a plurality of the vertical sides of the substrate.

10. The heat spreader recited in claim 7 wherein the metallization layer structure is disposed on at least one vertical side of the substrate.

11. The heat spreader recited in claim 7 wherein the metallization layer structure is disposed on a plurality of vertical sides of the substrate.

12. The heat spreader recited in claim 1 wherein the substrate is a ceramic substrate.

13. The heat spreader recited in claim 2 wherein the substrate is a ceramic substrate.

14. The heat spreader recited in claim 3 wherein the substrate is a ceramic substrate.

15. The heat spreader recited in claim 4 wherein the substrate is a ceramic substrate.

16. The heat spreader recited in claim 5 wherein the substrate is a ceramic substrate.

17. The heat spreader recited in claim 12 wherein the ceramic substrate is beryllium oxide.

18. The heat spreader recited in claim 13 wherein the ceramic substrate is beryllium oxide.

19. The heat spreader recited in claim 14 wherein the ceramic substrate is beryllium oxide.

20. The heat spreader recited in claim 15 wherein the ceramic substrate is beryllium oxide.