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1. WO2016153644 - MULTILAYER SUBSTRATE FOR A LIGHT EMITTING SEMI-CONDUCTOR DEVICE PACKAGE

Publication Number WO/2016/153644
Publication Date 29.09.2016
International Application No. PCT/US2016/018401
International Filing Date 18.02.2016
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H01L 33/64 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
CPC
H01L 33/642
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
642characterized by the shape
H05K 1/0207
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0207using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
H05K 1/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
H05K 1/111
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
H05K 2201/0162
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0162Silicon containing polymer, e.g. silicone
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • PALANISWAMY, Ravi
Agents
  • MOSHREFZADEH, Robert S.
Priority Data
62/135,80320.03.2015US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MULTILAYER SUBSTRATE FOR A LIGHT EMITTING SEMI-CONDUCTOR DEVICE PACKAGE
(FR) SUBSTRAT MULTICOUCHE POUR BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT À SEMI-CONDUCTEUR
Abstract
(EN)
A flexible multilayer substrate for attaching a light emitting semiconductor device includes a first dielectric layer, a circuit layer on the first dielectric layer; a first thermally conductive layer on the circuit layer; a discontinuous metal support layer having a plurality of openings therethrough disposed on the first thermally conductive layer, and a second thermally conductive layer on the support layer. The flexible multilayer substrate further includes a plurality of conductive vias extending through the first dielectric layer such that the circuit layer is in communication with the plurality of conductive vias. The first and second thermally conductive layers are in contact within said openings.
(FR)
L'invention porte sur un substrat multicouche souple, destiné à fixer un dispositif électroluminescent à semi-conducteur, qui comprend une première couche diélectrique ; une couche de circuit sur la première couche diélectrique ; une première couche thermoconductrice sur la couche de circuit ; une couche de support métallique discontinue comportant une pluralité d'ouvertures à travers elle disposée sur la première couche thermoconductrice ; et une seconde couche thermoconductrice sur la couche de support. Le substrat multicouche souple comprend en outre une pluralité de trous d'interconnexion conducteurs s'étendant à travers la première couche diélectrique de manière que la couche de circuit soit en communication avec la pluralité de trous d'interconnexion conducteurs. Les première et seconde couches thermoconductrices sont en contact à l'intérieur desdites ouvertures.
Also published as
Latest bibliographic data on file with the International Bureau