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1. WO2016153069 - METHOD FOR MANUFACTURING FLEXIBLE MOUNTING MODULE BODY

Publication Number WO/2016/153069
Publication Date 29.09.2016
International Application No. PCT/JP2016/059831
International Filing Date 28.03.2016
IPC
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 2224/73204
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73201on the same surface
73203Bump and layer connectors
73204the bump connector being embedded into the layer connector
H01L 2224/83192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83192wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
H05K 1/028
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
H05K 2201/0221
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0221Insulating particles having an electrically conductive coating
H05K 2201/10128
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10128Display
Applicants
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP]/[JP]
Inventors
  • 松島 隆行 MATSUSHIMA Takayuki
Agents
  • 石島 茂男 ISHIJIMA, Shigeo
Priority Data
2015-06526126.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING FLEXIBLE MOUNTING MODULE BODY
(FR) PROCÉDÉ DE FABRICATION DE CORPS DE MODULE DE MONTAGE FLEXIBLE
(JA) 可撓性実装モジュール体の製造方法
Abstract
(EN)
Electrical connection is ensured between an electronic component (9) using an anisotropic conductive film (12) and electrodes (6). An adhesive film (20) is affixed to a back surface side in an implementation region (10) of a flexible substrate (11), and the electronic component (9) is mounted on a front surface side. The adhesive film (20) comprises a base material film (22) with an adhesive agent layer (21) formed thereon, the adhesive agent layer (21) including an adhesive agent (26) containing spherical particles (25) with a diameter of not less than 75% and not more than 95% of the film thickness of the adhesive agent layer (21). When the anisotropic conductive film (12) is disposed in the implementation region (10) and the electronic component (9) is mounted thereon by heating and pressing, as the adhesive agent layer (21) is heated and pressed so as to push out the adhesive agent (26), the individual spherical particles (25) contact the base material film (22) and the flexible substrate (11), whereby the film thickness of the adhesive agent layer (21) does not become smaller than the diameter of the spherical particles (25), while the conductive particles (19) held between bumps (13) and the electrodes (6) are pressed and crushed, ensuring electrical connection.
(FR)
La connexion électrique est assurée entre un composant électronique (9) utilisant un film conducteur anisotrope (12) et des électrodes (6). Un film adhésif (20) est fixé à un côté de surface arrière dans la région de montage (10) d'un substrat flexible (11), et le composant électronique (9) est monté sur un côté de surface avant. Le film adhésif (20) comprend un film de matériau de base (22) sur lequel est formée une couche d'agent adhésif (21), la couche d'agent adhésif (21) comprenant un agent adhésif (26) contenant des particules sphériques (25) d'un diamètre qui n'est pas inférieur à 75 % et ne dépasse pas 95 % de l'épaisseur de film de la couche d'agent adhésif (21). Lorsque le film conducteur anisotrope (12) est disposé dans la région de montage (10) et que le composant électronique (9) est installé sur celui-ci par chauffage et compression, au moment où la couche d'agent adhésif (21) est chauffée et pressée de manière à expulser l'agent adhésif (26), les particules sphériques individuelles (25) viennent en contact avec le film de matériau de base (22) et le substrat flexible (11), l'épaisseur de film de la couche d'agent adhésif (21) ne devenant pas inférieure au diamètre des particules sphériques (25), tandis que les particules conductrices (19) retenues entre des bosses (13) et les électrodes (6) sont comprimées et écrasées, assurant ainsi la connexion électrique.
(JA)
 異方性導電膜(12)を用いた電子部品(9)と電極(6)との間の電気的接続を確実にする。 可撓性基板(11)の実装領域(10)の裏面側に、粘着フィルム(20)を貼付しておき、表面側に電子部品(9)を搭載する。粘着フィルム(20)は、基材フィルム(22)上に、粘着剤層(21)が形成されており、粘着剤層(21)の粘着剤(26)中には、粘着剤層(21)の膜厚の75%以上95%以下の直径を有する球形粒子(25)が含有されている。実装領域(10)上に異方性導電膜(12)を配置してその上に電子部品(9)を加熱及び押圧して搭載する際に、粘着剤層(21)が加熱・押圧されて粘着剤(26)が押し出されると、一個の球形粒子(25)が基材フィルム(22)と可撓性基板(11)とに接触するから、粘着剤層(21)の膜厚は、球形粒子(25)の直径よりも小さくならず、バンプ(13)と電極(6)との間に挟まれた導電粒子(19)は、押圧されて潰されるので、電気的接続が確実になる。
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