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1. WO2016152656 - PHOTOSENSITIVE RESIN COMPOSITION

Publication Number WO/2016/152656
Publication Date 29.09.2016
International Application No. PCT/JP2016/058175
International Filing Date 15.03.2016
IPC
G03F 7/023 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
C08G 8/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Condensation polymers of aldehydes or ketones with phenols only
04of aldehydes
08of formaldehyde, e.g. of formaldehyde formed in situ
10with phenol
C08G 73/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
14Polyamide-imides
C08G 73/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
22Polybenzoxazoles
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
CPC
C08G 73/1042
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
C08G 73/105
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1046Polyimides containing oxygen in the form of ether bonds in the main chain
105with oxygen only in the diamino moiety
C08G 73/106
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
106containing silicon
C08G 73/1082
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1075Partially aromatic polyimides
1082wholly aromatic in the tetracarboxylic moiety
C08G 73/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
14Polyamide-imides
C08G 73/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
22Polybenzoxazoles
Applicants
  • 東レ株式会社 TORAY INDUSTRIES, INC. [JP]/[JP]
Inventors
  • 池田 芳史 IKEDA, Yoshifumi
Agents
  • 清流国際特許業務法人 SEIRYU PATENT PROFESSIONAL CORPORATION
Priority Data
2015-06401326.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物
Abstract
(EN)
Provided is a photosensitive resin composition that, despite having high sensitivity, can improve cohesion between a pattern curing film and metal wiring subsequent to a reflow process in a pattern curing film of a semiconductor device. This photosensitive resin composition is characterized by containing: at least one alkali-soluble resin selected from (a-1) resins principally containing a structure represented by general formula (1), (a-2) polyimides, and copolymers of these; and (c) a compound principally containing a structure represented by general formula (2).
(FR)
L'invention concerne une composition de résine photosensible qui, bien qu'ayant une sensibilité élevée, peut améliorer la cohésion entre un film de durcissement de motif et un câblage métallique consécutivement à un traitement de refusion d'un film de durcissement d'un dispositif à semi-conducteurs. La présente composition de résine photosensible est caractérisée par le fait qu'elle contient : au moins une résine soluble dans les alcalis choisie parmi des résines (a-1) contenant principalement une structure représentée par la formule générale (1), des polyimides (a-2), et des copolymères de ces derniers ; et (c) un composé contenant principalement une structure représentée par la formule générale (2).
(JA)
半導体装置のパターン硬化膜において、高感度でありながらリフロー処理後のパターン硬化膜と金属配線との密着性を向上させることができる感光性樹脂組成物を提供する。 感光性樹脂組成物は(a-1)一般式(1)で表される構造を主成分とする樹脂、(a-2)ポリイミド、およびそれらの共重合体、から選ばれる少なくとも1種類を含むアルカリ可溶性樹脂、および、(c)一般式(2)で表される構造を主成分とする化合物とを含有することを特徴とする。
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