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1. WO2016152599 - LAMINATE BODY, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM

Publication Number WO/2016/152599
Publication Date 29.09.2016
International Application No. PCT/JP2016/057906
International Filing Date 14.03.2016
IPC
B32B 7/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
04Interconnection of layers
12using interposed adhesives or interposed materials with bonding properties
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C09J 7/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
CPC
B32B 2250/02
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2250Layers arrangement
022 layers
B32B 2307/51
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
50having particular mechanical properties
51Elastic
B32B 2307/54
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
50having particular mechanical properties
54Yield strength; Tensile strength
B32B 2307/542
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
50having particular mechanical properties
542Shear strength
B32B 2307/732
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
70Other properties
732Dimensional properties
B32B 2307/748
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
70Other properties
748Releasability
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 加持 義貴 KAMOCHI Yoshitaka
  • 岩井 悠 IWAI Yu
  • 沢野 充 SAWANO Mitsuru
  • 小山 一郎 KOYAMA Ichiro
  • 中村 敦 NAKAMURA Atsushi
Agents
  • 特許業務法人特許事務所サイクス SIKS & CO.
Priority Data
2015-06007823.03.2015JP
2016-03824529.02.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LAMINATE BODY, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM
(FR) CORPS STRATIFIÉ, COMPOSITION À ADHÉRENCE TEMPORAIRE, ET FILM À ADHÉRENCE TEMPORAIRE
(JA) 積層体、仮接着用組成物および仮接着膜
Abstract
(EN)
A laminate body, a temporary adhesive composition and a temporary adhesion film are provided which can make warpage less prone to occur even when a wafer is thin. This laminate body comprises, in order and adjacent to each other, a first substrate, a temporary adhesion film and a second substrate. At 25°C, the temporary adhesion film has a modulus of elasticity in tension E of 25-2000 MPa, in accordance with JIS K 7161:1994. One substrate of the laminate body, either the first substrate or the second substrate, is fixed at the temperature of 25°C. The end portion of the other substrate can be separated by lifting said end portion of the other substrate away from the interface with the temporary adhesion film at a speed of 50 mm/m in the direction perpendicular to the surface of said other substrate, and the force applied during said lifting is less than or equal to 0.33 N/mm when measured with a force gauge.
(FR)
L'invention concerne un corps stratifié, une composition à adhérence temporaire et un film à adhérence temporaire, lesquels peuvent rendre un voile moins susceptible de se produire même quand une tranche est mince. Ce corps stratifié comprend, dans l'ordre et adjacents les uns aux autres, un premier substrat, un film à adhérence temporaire et un second substrat. À 25 °C, le film à adhérence temporaire a un module d'élasticité en tension E de 25 à 2000 MPa, selon la norme JIS K 7161:1994. Un substrat du corps stratifié, soit le premier substrat soit le second substrat, est fixé à la température de 25° C. La partie d'extrémité de l'autre substrat peut être séparée par soulèvement de ladite partie d'extrémité de l'autre substrat à partir de l'interface avec le film à adhérence temporaire à une vitesse de 50 mm/m dans la direction perpendiculaire à la surface dudit autre substrat, et la force appliquée pendant ledit soulèvement est inférieure ou égale à 0,33 N/mm quand elle est mesurée avec un dynamomètre de traction.
(JA)
 ウェハを薄型にしても、反りが発生しにくくすることが可能な、積層体、仮接着用組成物および仮接着膜の提供。 第1の基材と、仮接着膜と、第2の基材を、上記順に互いに隣接して有する積層体であって、仮接着膜は、25℃の時の、JIS K 7161:1994に準拠した、引張弾性率Eが25~2000MPaであり、積層体の、25℃の温度で、第1の基材および第2の基材のいずれか一方を固定し、他方の基材の端部を、仮接着膜との界面から、50mm/分の速さで、他方の基材の基材面に対し垂直な方向に、他方の基材の端部を引き上げることによって、剥離可能で、かつ、引き上げる際にかかる力を、フォースゲージを用いて測定したときの力が0.33N/mm以下である、積層体。
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