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1. WO2016152271 - RESIN COMPOSITION, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH REAR-SURFACE GRINDING TAPE, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH DICING TAPE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Publication Number WO/2016/152271
Publication Date 29.09.2016
International Application No. PCT/JP2016/053341
International Filing Date 04.02.2016
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
C09J 4/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 7/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
C09J 7/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
C09J 11/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 133/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
CPC
C09J 11/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
04inorganic
C09J 133/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 4/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
C09J 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 福井 章洋 FUKUI, Akihiro
  • 高本 尚英 TAKAMOTO, Naohide
  • 花園 博行 HANAZONO, Hiroyuki
Agents
  • 特許業務法人 ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE
Priority Data
2015-06276425.03.2015JP
2015-09387401.05.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH REAR-SURFACE GRINDING TAPE, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH DICING TAPE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE, COMPOSITION DE RÉSINE EN FORME DE FEUILLE INTÉGRÉE À UNE BANDE ABRASIVE DE SURFACE ARRIÈRE, COMPOSITION DE RÉSINE EN FORME DE FEUILLE INTÉGRÉE À UNE BANDE DE DÉCOUPAGE EN DÉS, PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR, ET DISPOSITIF À SEMI-CONDUCTEUR
(JA) 樹脂組成物、裏面研削用テープ一体型シート状樹脂組成物、ダイシングテープ一体型シート状樹脂組成物、半導体装置の製造方法、及び、半導体装置
Abstract
(EN)
The present invention is a resin composition used to seal an interface between an adherend and a semiconductor element that is flipchip-bonded to the adherend, wherein the resin composition contains a radical reactive compound, a thermoplastic resin, and an inorganic filler, and the proportion of the radical reactive compound relative to the constituents of the entire resin composition, excluding the inorganic filler, is 18.5 weight% or more.
(FR)
La présente invention porte sur une composition de résine utilisée pour étanchéifier une interface entre une surface d'adhérence et un élément à semi-conducteur qui est connecté par bossage à la surface d'adhérence, la composition de résine contenant un composé réactif radicalaire, une résine thermoplastique et une charge inorganique, et la proportion du composé réactif radicalaire par rapport aux constituants de la composition de résine entière, à l'exclusion de la charge inorganique, étant supérieure ou égale à 18,5 % en poids.
(JA)
 被着体と前記被着体上にフリップチップ接続された半導体素子との界面封止に用いられる樹脂組成物であって、ラジカル反応性化合物と熱可塑性樹脂と無機充填剤とを含有し、樹脂組成物全体から無機充填剤を除いた成分に対するラジカル反応性化合物の割合が18.5重量%以上である樹脂組成物。
Also published as
Latest bibliographic data on file with the International Bureau