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1. (WO2016150080) FLIP CHIP BONDING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/150080 International Application No.: PCT/CN2015/087199
Publication Date: 29.09.2016 International Filing Date: 17.08.2015
IPC:
H01L 21/603 (2006.01) ,H01L 21/768 (2006.01) ,H01L 21/677 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
603
involving the application of pressure, e.g. thermo-compression bonding
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
北京中电科电子装备有限公司 CETC BEIJING ELECTRONIC EQUIPMENT CO.,LTD. [CN/CN]; 中国北京市 经济技术开发区泰河三街1号 No.1,Taihe 3rd Street, Beijing Economy and Technology Development Zone Beijing 100176, CN
Inventors:
唐亮 TANG, Liang; CN
叶乐志 YE, Lezhi; CN
周启舟 ZHOU, Qizhou; CN
徐品烈 XU, Pinlie; CN
郎平 LANG, Ping; CN
霍杰 HUO, Jie; CN
刘子阳 LIU, Ziyang; CN
Agent:
北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM; 中国北京市 海淀区西直门北大街32号院枫蓝国际中心2号楼10层 10F, Bldg. 2, Maples International Center No. 32 Xizhimen North Street, Haidian District Beijing 100082, CN
Priority Data:
201510124424.320.03.2015CN
Title (EN) FLIP CHIP BONDING DEVICE
(FR) DISPOSITIF DE SOUDAGE DE PUCES RETOURNÉES
(ZH) 一种倒装芯片键合设备
Abstract:
(EN) The present disclosure provides a flip chip bonding device, comprising a chip transmission mechanism, the chip transmission mechanism comprising an installation part and a driving part configured to drive the installation part to move, the installation part comprising a plurality of workstations for bearing chips, wherein the chip located on one of the workstations is moved from a first position to a second position through movement of the installation part; a first chip grabbing mechanism, configured to overturn the chips upwards from the lower side after grabbing the chips and putting the chips on the workstations located in the first position on the installation part after overturning the chips; a second chip grabbing mechanism, configured to take out the chips on the workstations located in the second position on the installation part so as to bond. The present disclosure introduces the precise chip transmission mechanism, the reliability is high, and the flip chip bonding device is enabled to be applicable to flip chip bonding of large-scale base materials while not reducing the efficiency, thereby greatly increasing the chip installation accuracy.
(FR) La présente invention concerne un dispositif de soudage de puces retournées, comprenant un mécanisme de transmission de puces, le mécanisme de transmission de puces comprenant une partie d’installation et une partie d’entraînement servant à entraîner le mouvement de la partie d’installation, la partie d’installation comprenant une pluralité de postes de travail pour le support de puces, la puce située sur un des postes de travail étant déplacée d’une première position à une deuxième position par le mouvement de la partie d’installation ; un premier mécanisme de saisie de puces, servant à retourner les puces vers le haut depuis le côté inférieur après avoir saisi les puces et posant les puces sur les postes de travail situés à la première position sur la partie d’installation après avoir retourné les puces ; un second mécanisme de saisie de puces, servant à prendre les puces sur les postes de travail placés à la deuxième position sur la partie d’installation à des fins de soudage. La présente invention introduit le mécanisme de transmission de puces précis, la fiabilité est élevée, et le dispositif de soudage de puces retournées peut être applicable au soudage de puces retournées de matériaux de base à grande échelle sans réduire le rendement, augmentant ainsi grandement la précision d’installation de puces.
(ZH) 本公开提供了一种倒装芯片键合设备,包括:芯片传输机构,所述芯片传输机构包括:安装部和用于驱动所述安装部运动的驱动部,所述安装部包括多个用于放置芯片的工位;其中,通过所述安装部的运动,将位于其中一个工位上的芯片从第一位置处移动至第二位置处;第一芯片抓取机构,其用于抓取芯片后将所述芯片由下侧向上翻转,并在将所述芯片翻转后,将所述芯片放置在所述安装部上位于所述第一位置处的工位上;第二芯片抓取机构,其用于将所述安装部上位于所述第二位置处的工位上的芯片取出,以进行键合。本公开引入了精密的芯片传输机构,可靠性高,使得倒装芯片键合设备在不降低效率的情况下适应大尺寸基材的倒装键合,大大提高了装片精度。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)