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1. WO2016148429 - FLEXIBLE PRINTED CIRCUIT BOARD

Publication Number WO/2016/148429
Publication Date 22.09.2016
International Application No. PCT/KR2016/002327
International Filing Date 09.03.2016
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
Applicants
  • 주식회사 기가레인 GIGALANE CO.,LTD. [KR]/[KR]
Inventors
  • 김상필 KIM, Sang Pil
  • 김대호 KIM, Dae Ho
  • 이동형 LEE, Dong Hyung
  • 조병훈 JO, Byung Hoon
  • 이다연 LEE, Da Yeon
  • 구황섭 KOO, Hwang Sub
  • 김현제 KIM, Hyun Je
  • 정희석 JUNG, Hee Seok
  • 김익수 KIM, Ik Soo
Agents
  • 오욱 OH, Uk
Priority Data
10-2015-003724018.03.2015KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) FLEXIBLE PRINTED CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ SOUPLE
(KO) 연성회로기판
Abstract
(EN)
A flexible printed circuit board is introduced. The flexible printed circuit board according to the present invention comprises: a first substrate; and a second substrate which is extended from the first substrate and which has a thinner thickness than the first substrate so as to be capable of bending.
(FR)
L'invention concerne une carte de circuit imprimé souple. La carte de circuit imprimé souple selon la présente invention comprend : un premier substrat ; et un deuxième substrat qui s'étend à partir du premier substrat et dont l'épaisseur est inférieure à celle du premier substrat de manière à pouvoir fléchir.
(KO)
연성회로기판이 소개된다. 본 발명의 연성회로기판은 제1기판부 및 상기 제1기판부에서 연장 형성되고, 벤딩(bending) 가능하도록 상기 제1기판부보다 얇은 두께로 형성된 제2기판부를 포함한다.
Also published as
Latest bibliographic data on file with the International Bureau