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1. WO2016148409 - ABRASIVE GRAINS AND POLISHING SLURRY COMPOSITION CONTAINING SAME

Publication Number WO/2016/148409
Publication Date 22.09.2016
International Application No. PCT/KR2016/001700
International Filing Date 22.02.2016
IPC
C09K 3/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
CPC
C09K 3/14
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
Applicants
  • 주식회사 케이씨텍 K.C.TECH CO., LTD [KR]/[KR]
Inventors
  • 황준하 HWANG, Jun Ha
  • 정기화 JUNG, Ki Hwa
  • 황진명 HWANG, Jin Myung
  • 권창길 KWON, Chang Gil
  • 이재우 LEE, Jae Woo
Agents
  • 특허법인 무한 MUHANN PATENT & LAW FIRM
Priority Data
10-2015-003490713.03.2015KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) ABRASIVE GRAINS AND POLISHING SLURRY COMPOSITION CONTAINING SAME
(FR) GRAINS ABRASIFS ET COMPOSITION DE PÂTE DE POLISSAGE LES CONTENANT
(KO) 연마입자 및 그를 포함하는 연마 슬러리 조성물
Abstract
(EN)
The present invention relates to abrasive grains and a polishing slurry composition containing the same. The abrasive grains according to one embodiment of the present invention have 1.3% or more of a dispersant adsorption amount with respect to the total weight percentage of the abrasive grains at a temperature of 0 to 1,000°C.
(FR)
La présente invention concerne des grains abrasifs et une composition de pâte de polissage les contenant. Les grains abrasifs selon un mode de réalisation de la présente invention présentent une proportion d'adsorption de dispersant supérieure ou égale à 1,3 % par rapport au pourcentage en poids total des grains abrasifs à une température de 0 à 1 000 °C.
(KO)
본 발명은 연마입자 및 그를 포함하는 연마 슬러리 조성물에 관한 것으로서, 본 발명의 일 실시예에 따른 연마입자는, 0℃ 내지 1,000℃의 온도에서 분산제 흡착량이 연마입자 전체 무게 비율 대비 1.3 % 이상인 것이다.
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