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1. WO2016148176 - POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, TFT SUBSTRATE, INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND METHODS FOR PRODUCING SAME

Publication Number WO/2016/148176
Publication Date 22.09.2016
International Application No. PCT/JP2016/058276
International Filing Date 16.03.2016
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/023 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
CPC
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/023
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Applicants
  • 東レ株式会社 TORAY INDUSTRIES, INC. [JP]/[JP]
Inventors
  • 此島陽平 KONOSHIMA, Yohei
  • 日比野利保 HIBINO, Toshiyasu
  • 諏訪充史 SUWA, Mitsuhito
Priority Data
2015-05604319.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, TFT SUBSTRATE, INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND METHODS FOR PRODUCING SAME
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE POSITIVE, FILM DURCI, SUBSTRAT DE TRANSISTOR À COUCHES MINCES, FILM ISOLANT INTERCOUCHE, DISPOSITIF D'AFFICHAGE ET PROCÉDÉS PERMETTANT DE PRODUIRE CES DERNIERS
(JA) ポジ型感光性樹脂組成物、硬化膜、TFT基板、層間絶縁膜、表示装置、およびその製造方法
Abstract
(EN)
The present invention provides a positive photosensitive resin composition which leaves remarkably little residue when developed and with which a cured film that is excellent in terms of high transparency, high chemical resistance, high dielectric constant, and low leakage current can be obtained. The present invention is a positive photosensitive resin composition that is characterized by containing (A) metal oxide particles, (B) at least one type of polymer selected from among a polyimide precursor, a polybenzoxazole precursor, a polyimide, and a polybenzoxazole, and (C) an aromatic compound having a hydroxyl group and/or a thiol group.
(FR)
La présente invention concerne une composition de résine photosensible positive qui laisse de façon remarquable peu de résidus lorsqu'elle est développée et avec laquelle peut être obtenu un film durci qui est excellent en termes de transparence élevée, de résistance chimique élevée, de constante diélectrique élevée, et de faible courant de fuite. La présente invention est une composition de résine photosensible positive qui est caractérisée par le fait qu'elle contient : (A) des particules d'oxyde métallique ; (B) au moins un type de polymère choisi parmi un précurseur de polyimide, un précurseur de polybenzoxazole, un polyimide et un polybenzoxazole ; et (C) un composé aromatique ayant un groupe hydroxyle et/ou un groupe thiol.
(JA)
本発明は、現像加工時の残渣が顕著に少なく、高透明、高耐薬品性、高誘電率および低リーク電流に優れた性質を有する硬化膜を得ることが可能な、ポジ型感光性樹脂組成物を提供する。本発明は、(A)金属酸化物粒子、(B)ポリイミド前駆体、ポリベンゾオキサゾール前駆体、ポリイミド、ポリベンゾオキサゾールより選ばれる1種以上のポリマー、(C)水酸基および/またはチオール基を有する芳香族化合物を含むことを特徴とするポジ型感光性樹脂組成物である。
Also published as
Latest bibliographic data on file with the International Bureau