Processing

Please wait...

Settings

Settings

Goto Application

1. WO2016147986 - ELASTIC WAVE DEVICE AND PRODUCTION METHOD FOR SAME

Publication Number WO/2016/147986
Publication Date 22.09.2016
International Application No. PCT/JP2016/057411
International Filing Date 09.03.2016
IPC
H03H 9/25 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25Constructional features of resonators using surface acoustic waves
H03H 3/02 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
02for the manufacture of piezo-electric or electrostrictive resonators or networks
H03H 3/08 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
H03H 9/145 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
125Driving means, e.g. electrodes, coils
145for networks using surface acoustic waves
H03H 9/17 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
17having a single resonator
CPC
H01L 41/338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
33Shaping or machining of piezo-electric or electrostrictive bodies
335by machining
338by cutting or dicing
H03H 2003/025
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
02for the manufacture of piezo-electric or electrostrictive resonators or networks
025the resonators or networks comprising an acoustic mirror
H03H 3/02
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
02for the manufacture of piezo-electric or electrostrictive resonators or networks
H03H 3/04
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
02for the manufacture of piezo-electric or electrostrictive resonators or networks
04for obtaining desired frequency or temperature coefficient
H03H 3/08
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
H03H 3/10
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
10for obtaining desired frequency or temperature coefficient
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 岸本 諭卓 KISHIMOTO, Yutaka
Agents
  • 特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI
Priority Data
2015-05181616.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELASTIC WAVE DEVICE AND PRODUCTION METHOD FOR SAME
(FR) DISPOSITIF À ONDES ÉLASTIQUES ET SON PROCÉDÉ DE PRODUCTION
(JA) 弾性波装置及びその製造方法
Abstract
(EN)
Provided are an elastic wave device and a production method for the elastic wave device wherein layers do not easily separate during a dicing step. An elastic wave device 1 that is provided with: a piezoelectric body layer 2 that has a first main surface 2a and a second main surface 2b that is on the reverse side from the first main surface 2a; an acoustic reflection layer 5 that is laminated upon the first main surface 2a of the piezoelectric body layer 2; an excitation electrode that is provided to the piezoelectric body layer 2; and a support layer 6. As seen in plan view from the side of the second main surface 2b of the piezoelectric body layer 2, the acoustic reflection layer 5 is positioned so as to overlap at least the excitation electrode. At least as seen in plan view from the side of the second main surface 2b of the piezoelectric body layer 2, the support layer 6 is provided so as to surround the acoustic reflection layer 5.
(FR)
L’invention concerne un dispositif à ondes élastiques et un procédé de production du dispositif à ondes élastiques, des couches ne se séparant pas facilement pendant une étape de découpage. Elle concerne un dispositif à ondes élastiques (1) qui comporte : une couche de corps piézoélectrique (2) qui comprend une première surface principale (2a) et une deuxième surface principale (2b) qui est située du côté opposé à la première surface principale (2a) ; une couche de réflexion acoustique (5) qui est stratifiée sur la première surface principale (2a) de la couche de corps piézoélectrique (2) ; une électrode d’excitation qui est disposée sur la couche de corps piézoélectrique (2) ; et une couche de support (6). Lors d’une observation en vue planaire depuis le côté de la deuxième surface principale (2b) de la couche de corps piézoélectrique (2), la couche de réflexion acoustique (5) est positionnée de manière à recouvrir au moins l’électrode d’excitation. Au moins lors d’une observation en vue planaire depuis le côté de la deuxième surface principale (2b) de la couche de corps piézoélectrique (2), la couche de support (6) est positionnée de manière à entourer la couche de réflexion acoustique (5).
(JA)
 ダイシング工程の際に、層間の剥離が生じ難い、弾性波装置及びその製造方法を提供する。 弾性波装置1は、第1の主面2aと、該第1の主面2aに対向している第2の主面2bとを有する圧電体層2と、圧電体層2の第1の主面2a上に積層されている音響反射層5と、圧電体層2に設けられている励振電極と、支持層6とを備える。音響反射層5は、圧電体層2の第2の主面2b側からの平面視において、少なくとも励振電極と重なるように位置している。支持層6は、少なくとも、圧電体層2の第2の主面2b側からの平面視において、音響反射層5を囲むように設けられている。
Also published as
Other related publications
Latest bibliographic data on file with the International Bureau