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1. WO2016147904 - SOLID-STATE IMAGING ELEMENT, IMAGING MODULE, AND ELECTRONIC DEVICE

Publication Number WO/2016/147904
Publication Date 22.09.2016
International Application No. PCT/JP2016/056731
International Filing Date 04.03.2016
IPC
H04N 5/369 2011.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors
369SSIS architecture; Circuitry associated therewith
G03B 5/00 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
5Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
H04N 5/225 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
H04N 5/232 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
232Devices for controlling television cameras, e.g. remote control
CPC
G03B 2217/005
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
2217Details of cameras or camera bodies; Accessories therefor
005Blur detection
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
H04N 5/23254
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
232Devices for controlling television cameras, e.g. remote control ; ; Control of cameras comprising an electronic image sensor;
23248for stable pick-up of the scene in spite of camera body vibration
23251Motion detection
23254based on the image signal
H04N 5/23258
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
232Devices for controlling television cameras, e.g. remote control ; ; Control of cameras comprising an electronic image sensor;
23248for stable pick-up of the scene in spite of camera body vibration
23251Motion detection
23258based on additional sensors
H04N 5/23267
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
232Devices for controlling television cameras, e.g. remote control ; ; Control of cameras comprising an electronic image sensor;
23248for stable pick-up of the scene in spite of camera body vibration
23264Vibration or motion blur correction
23267performed by a processor, e.g. controlling the readout of an image memory
Applicants
  • ソニー株式会社 SONY CORPORATION [JP]/[JP]
Inventors
  • 渡邊 翔太 WATANABE Shota
Agents
  • 西川 孝 NISHIKAWA Takashi
Priority Data
2015-05626219.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SOLID-STATE IMAGING ELEMENT, IMAGING MODULE, AND ELECTRONIC DEVICE
(FR) ÉLÉMENT IMAGEUR À SEMI-CONDUCTEURS, MODULE IMAGEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) 固体撮像素子、撮像モジュール、および電子機器
Abstract
(EN)
This disclosure relates to a solid-state imaging element, an imaging module, and an electronic device, which make it possible to avoid an increase in the size of an imaging element due to an increase in the functionality thereof. A solid-state imaging element is configured by stacking an image sensor substrate in which a plurality of pixels are disposed on a sensor surface, and a signal processing substrate for performing signal processing on an image signal outputted from the image sensor substrate. The signal processing substrate comprises an electronic blurring correction processing unit for electronically correcting blurring of an image captured in the image sensor substrate; a first connection part for connecting with an optical blurring correction processing unit for optically correcting the blurring of the image captured in the image sensor substrate; and a second connection part for connecting with a gyro sensor for detecting the blurring that has occurred in the image. The solid-state imaging element has a connection configuration in which at least some of signals transmitted and received between the gyro sensor and the optical blurring correction processing unit go through the inside of the signal processing substrate. This technology is applicable, for example, to a stacked solid-state imaging element.
(FR)
La présente invention concerne un élément imageur à semi-conducteurs, un module imageur et un dispositif électronique qui permettent d'éviter une augmentation de la taille d'un élément imageur due à une augmentation de la fonctionnalité de celui-ci. L'élément imageur à semi-conducteurs est conçu par l'empilement d'un substrat de capteur d'image, dans lequel une pluralité de pixels sont placés sur une surface de capteur, et d'un substrat de traitement de signal destiné à mettre en oeuvre un traitement de signal sur un signal d'image produit par le substrat de capteur d'image. Le substrat de traitement de signal comprend une unité de traitement de correction de flou électronique servant à corriger le flou d'une image capturée dans le substrat de capteur d'image; une première partie de connexion, qui se connecte à une unité de traitement de correction optique de flou servant à corriger optiquement le flou de l'image capturée dans le substrat de capteur d'image; et une deuxième partie de connexion, qui se connecte à un capteur gyroscopique pour détecter le flou présent dans l'image. L'élément d'imagerie à semi-conducteurs présente une configuration de connexion dans laquelle au moins certains des signaux transmis et reçus entre le capteur gyroscopique et l'unité de traitement de correction optique de flou, traversent la partie intérieure du substrat de traitement de signal. Cette technologie est applicable, par exemple, à un élément imageur à semi-conducteurs empilé.
(JA)
 本開示は、撮像素子の高機能化による大型化を回避することができるようにする固体撮像素子、撮像モジュール、および電子機器に関する。 固体撮像素子は、複数の画素がセンサ面に配置されたイメージセンサ基板と、イメージセンサ基板から出力される画像信号に対する信号処理を行う信号処理基板とが積層されて構成される。また、信号処理基板は、イメージセンサ基板において撮像される画像のブレに対して電子的に補正を行う電子ブレ補正処理部と、イメージセンサ基板において撮像される画像のブレに対して光学的に補正を行う光学ブレ補正処理部との接続を行う第1の接続部と、画像に発生するブレを検出するジャイロセンサとの接続を行う第2の接続部とを有する。そして、ジャイロセンサおよび光学ブレ補正処理部の間で送受信される信号の少なくとも一部が、信号処理基板の内部を経由する接続構成である。本技術は、例えば、積層型の固体撮像素子に適用できる。
Also published as
CN201680001095.6
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