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1. WO2016145661 - EPOXY MOLDING COMPOUND, ITS MANUFACTURING PROCESS AND USE, AND TRANSISTOR OUTLINE PACKAGE PRODUCT CONTAINING MOLDED PRODUCT THEREOF

Publication Number WO/2016/145661
Publication Date 22.09.2016
International Application No. PCT/CN2015/074603
International Filing Date 19.03.2015
IPC
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08K 13/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
13Use of mixtures of ingredients not covered by any single one of main groups C08K3/-C08K11/128
02Organic and inorganic ingredients
C08K 3/20 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
C08K 3/36 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08K 7/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
02Fibres or whiskers
04inorganic
14Glass
CPC
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
Applicants
  • HYSOL HUAWEI ELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • FAN, Lang
  • MEI, Hujie
  • YAN, Jiyan
  • DING, Quanqing
  • SHEN, Shuangshuang
  • ZHANG, Xiaoliang
Agents
  • NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) EPOXY MOLDING COMPOUND, ITS MANUFACTURING PROCESS AND USE, AND TRANSISTOR OUTLINE PACKAGE PRODUCT CONTAINING MOLDED PRODUCT THEREOF
(FR) COMPOSÉ DE MOULAGE ÉPOXY, SON PROCÉDÉ DE FABRICATION ET D'UTILISATION, ET PRODUIT DE BOÎTIER DE CONTOUR DE TRANSISTOR CONTENANT UN PRODUIT MOULÉ DE CELUI-CI
Abstract
(EN)
An epoxy molding compound is provided, the compound comprises (a) 2 to 15wt.%of an epoxy resin; (b) 2 to 15wt.%of a phenolic resin; (c) 60 to 90 wt.% of a filler; (d) 0.1 to 0.6wt.%of a catalyst; (e) 0.1 to 3 wt.% of a releasing agent; (f) 0.1 to 1 wt.% of a pigment; (g) 0.05 t0 3 wt.% of a silane; (h) 0 to 3 wt.% of an ion trapping agent; (i) 0 to 15 wt.% of a flame retardant; and (j) o to 2wt.% of a stress modifier; wherein the weight percentages are based on the total weight of the epoxy molding compound. By using specific components and their specific amounts, the molded products produced from the epoxy molding compounds can be used in high current applications, especially in high current TO products.
(FR)
La présente invention concerne un composé de moulage époxy, ledit composé comprenant (a) de 2 à 15 % en poids d'une résine époxy; (b) de 2 à 15 % en poids d'une résine phénolique; (c) de 60 à 90 % en poids d'une charge; (d) de 0,1 à 0,6 % en poids d'un catalyseur; (e) de 0,1 à 3 % en poids d'un agent de démoulage; (f) de 0,1 à 1 % en poids d'un pigment; (g) de 0,05 à 3 % en poids d'un silane; (h) de 0 à 3 % en poids d'un agent de piégeage d'ions; (i) de 0 à 15 % en poids d'une charge ignifugeante; et (j) de 0 à 2 % en poids d'un modificateur de contrainte; les pourcentages en poids étant basés sur le poids total en composé de moulage époxy. En utilisant des composants spécifiques et leurs quantités spécifiques, les produits moulés produits à partir des composés de moulage époxy peuvent être utilisés dans des applications à courant élevé, en particulier dans des produits de contour de transistor (TO) à courant élevé.
Also published as
Latest bibliographic data on file with the International Bureau