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1. WO2016144159 - SYSTEM AND METHOD FOR DECAPSULATION OF PLASTIC INTEGRATED CIRCUIT PACKAGES

Publication Number WO/2016/144159
Publication Date 15.09.2016
International Application No. PCT/NL2016/050145
International Filing Date 03.03.2016
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01J 37/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
CPC
H01J 37/3222
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32192Microwave generated discharge
32211Means for coupling power to the plasma
3222Antennas
H01J 37/32247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32192Microwave generated discharge
32211Means for coupling power to the plasma
32247Resonators
H01J 37/32256
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32192Microwave generated discharge
32211Means for coupling power to the plasma
32247Resonators
32256Tuning means
H01J 37/32348
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32348Dielectric barrier discharge
H01L 21/67126
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
H05H 1/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
HPLASMA TECHNIQUE
1Generating plasma; Handling plasma
24Generating plasma
46using applied electromagnetic fields, e.g. high frequency or microwave energy
Applicants
  • JIACO INSTRUMENTS HOLDING B.V. [NL]/[NL]
Inventors
  • TANG, Jiaqi
Agents
  • VAN BREDA, Jacques
Priority Data
201441506.03.2015NL
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SYSTEM AND METHOD FOR DECAPSULATION OF PLASTIC INTEGRATED CIRCUIT PACKAGES
(FR) SYSTÈME ET PROCÉDÉ DE DÉCAPSULATION DE CONDITIONNEMENTS PLASTIQUES DE CIRCUITS INTÉGRÉS
Abstract
(EN)
System and method for decapsulation of plastic inte grated circuit packages (2), comprising the steps of -providing a microwave generator (3); -providing a Beenakker resonant cavity (4) connected to the microwave generator (3), which Beenakker resonant cav ity (4) comprises a coupling antenna loop (7); -providing the Beenakker resonant cavity (4) with a tube (5) or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas; -optionally providing a wire (8) to the coupling an tenna loop (7); - providing that the Beenakker resonant cavity (4) is set at a predefined value of its Q factor by embodying the coupling antenna loop (7) and/or the said wire (8) optionally attached to the coupling antenna loop (7) in a metal or metal alloy, or providing that at least at part of its surface area the coupling antenna loop (7) and/or the said wire (8) is coated with a metal or metal alloy different than copper and with a higher resistivity than copper (1.724 x 10~s ohm.m).
(FR)
L'invention concerne un système et un procédé de décapsulation de conditionnements (2) plastiques de circuits intégrés, dont les étapes consistent - à produire un générateur de micro-ondes (3); - à produire une cavité résonante de Beenakker (4) connectée au générateur à micro-ondes (3), ladite cavité résonante de Beenakker (4) comprenant une antenne-cadre (7) de couplage; - à équiper la cavité résonante de Beenakker (4) d'un tube (5) ou de tubes pour l'injection de gaz de plasma et de gaz de gravure et de moyens d'allumer le gaz de plasma; - à équiper optionnellement l'antenne-cadre (7) de couplage d'un câble (8); - à faire en sorte que la cavité résonante de Beenakker (4) soit réglée à une valeur prédéfinie de son facteur Q en réalisant l'antenne-cadre (7) de couplage et/ou ledit câble (8) fixé optionnellement à l'antenne-cadre (7) de couplage dans un métal ou un alliage de métaux, ou à faire en sorte qu'au moins une partie de l'aire de surface de l'antenne-cadre (7) de couplage et/ou dudit câble (8) soit recouverte d'un métal ou d'un alliage de métaux différent du cuivre et présentant une résistivité supérieure à celle du cuivre (1,724 × 10~s ohm.m).
Also published as
Latest bibliographic data on file with the International Bureau