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1. WO2016143845 - SEALING CAP FOR ELECTRONIC COMPONENT

Publication Number WO/2016/143845
Publication Date 15.09.2016
International Application No. PCT/JP2016/057530
International Filing Date 10.03.2016
IPC
H01L 23/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
CPC
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 23/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 23/051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
043the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
051another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H01L 23/10
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
10characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 23/298
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
298Semiconductor material, e.g. amorphous silicon
Applicants
  • 田中貴金属工業株式会社 TANAKA KIKINZOKU KOGYO K.K. [JP]/[JP]
Inventors
  • 園田 定敏 SONODA, Sadatoshi
  • 岩谷 拓成 IWATANI, Takuji
  • 宮崎 兼一 MIYAZAKI, Kenichi
Agents
  • 特許業務法人田中・岡崎アンドアソシエイツ TANAKA AND OKAZAKI
Priority Data
2015-04878611.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEALING CAP FOR ELECTRONIC COMPONENT
(FR) CAPUCHON D'ÉTANCHÉITÉ POUR COMPOSANT ÉLECTRONIQUE
(JA) 電子部品封止用キャップ
Abstract
(EN)
The present invention is a cap for an electronic component used to manufacture a package that has a sealing region by connecting to a base, characterized by having a brazing material fusing surface that fuses with a brazing material and a sealing surface that corresponds to the sealing region, wherein the brazing material fusing surface has a non-flat surface to be worked formed by plastic working, wherein the ratio (Sf/Sc) of the surface area by unit area (Sf) of the sealing surface to the surface area by unit area (Sc) of the brazing material fusing surface is 1 < Sc/Sf ≤ 1.6. The cross-sectional shape of the surface to be worked can be made a groove, general V-shape, arc shape, etc. The cap according to the present invention has good wettability when the brazing material is fused and when remelted for sealing work, the brazing material does not spread excessively.
(FR)
La présente invention concerne un capuchon pour composant électronique utilisé pour fabriquer un boîtier qui comporte une zone d'étanchéité par liaison à une base, caractérisé en ce qu'il présente une surface de fusion de matériau de brasage qui fusionne avec un matériau de brasage et une surface d'étanchéité qui correspond à la zone d'étanchéité, la surface de fusion de matériau de brasage présentant une surface non plate à travailler formée par façonnage de plastique, le rapport (Sf/Sc) de la surface utile par unité de surface (Sf) de la surface d'étanchéité sur la surface utile par unité de surface (Sc) de la surface de fusion de matériau de brasage vérifiant 1 < Sc/Sf < 1,6. La forme de section transversale de la surface à travailler peut être une forme de rainure, une forme sensiblement en V, une forme arquée, etc. Le capuchon selon la présente invention présente une bonne mouillabilité quand le matériau de brasage est fondu, et quand il est refondu pour un travail d'étanchéité, le matériau de brasage ne s'étale pas excessivement.
(JA)
 本発明は、ベースと接合することで封止領域を有するパッケージを製造するための電子部品用のキャップにおいて、ろう材を融着するろう材融着面と、前記封止領域に対応する封止面とを有し、 前記ろう材融着面は、塑性加工により形成された平坦ではない被加工面を有し、前記ろう材融着面の単位面積当たりの表面積(Sc)と、前記封止面の単位面積当たりの表面積(Sf)との比(Sc/Sf)が、1<Sc/Sf≦1.6であることを特徴とする電子部品用のキャップである。被加工面の断面形状としては、溝形状・略V字形状・円弧形状等、各種形状にすることができる。本発明に係るキャップは、ろう材を融着させたときの濡れ性が良好であり、封止作業のために再融解させたときにろう材が過度に濡れ広がることもない。
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