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1. WO2016143425 - WIRELESS IC DEVICE, RESIN MOLDED ARTICLE COMPRISING SAME, COMMUNICATIONS TERMINAL DEVICE COMPRISING SAME, AND PRODUCTION METHOD THEREFOR

Publication Number WO/2016/143425
Publication Date 15.09.2016
International Application No. PCT/JP2016/053345
International Filing Date 04.02.2016
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
CPC
G06K 19/041
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
04characterised by the shape
041Constructional details
G06K 19/077
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07724
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
0772Physical layout of the record carrier
07724the record carrier being at least partially made by a molding process
G06K 19/07749
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
G06K 19/07773
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
07773Antenna details
H01L 21/4853
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 池田 直徒 IKEDA, Naoto
  • 萬代 俊治 MANDAI, Shunji
  • 齋藤 陽一 SAITO, Yoichi
Agents
  • 鮫島 睦 SAMEJIMA, Mutsumi
Priority Data
2015-04517006.03.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) WIRELESS IC DEVICE, RESIN MOLDED ARTICLE COMPRISING SAME, COMMUNICATIONS TERMINAL DEVICE COMPRISING SAME, AND PRODUCTION METHOD THEREFOR
(FR) DISPOSITIF DE CIRCUIT INTÉGRÉ SANS FIL, CORPS MOULÉ EN RÉSINE ÉQUIPÉ DE CE DISPOSITIF DE CIRCUIT INTÉGRÉ SANS FIL, ET DISPOSITIF DE TERMINAL DE COMMUNICATION ÉQUIPÉ DE CE CORPS MOULÉ EN RÉSINE AINSI QUE PROCÉDÉ DE FABRICATION DE CE DISPOSITIF DE TERMINAL DE COMMUNICATION
(JA) 無線ICデバイス、それを備えた樹脂成型体、それを備えた通信端末装置、及びその製造方法
Abstract
(EN)
Provided are: a wireless IC device that has excellent electrical characteristics and reduces obstruction of an antenna coil magnetic field by an RFIC element; a resin molded article comprising same; a communications terminal device comprising same; and a production method therefor. This wireless IC device comprises: an element body having a first main surface and a second main surface; an RFIC element embedded in the element body; and an antenna coil provided on the element body. The antenna coil comprises: a first wiring pattern formed on the second main surface; a first metal pin reaching the first main surface and the second main surface; a second metal pin reaching the first main surface and the second main surface; and a second wiring pattern formed on the first main surface. Terminal surfaces of a first I/O terminal and a second I/O terminal in the RFIC element are arranged facing the second main surface of the element body, are arranged separated from the antenna coil, and are connected to the first wiring pattern via a first conductor and a second conductor that extend from the second main surface of the element body in the first main surface direction.
(FR)
L’invention fournit un dispositif de circuit intégré sans fil qui réduit la gêne du champ magnétique d’une bobine d’antenne par un élément de circuit intégré radio fréquence, et qui possède d’excellentes caractéristiques électriques, et l’invention présente également un corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et un dispositif de terminal de communication équipé de ce corps moulé en résine ainsi qu’un procédé de fabrication de ce dispositif de terminal de communication. Le dispositif de circuit intégré sans fil de l’invention est équipé d’un corps d’élément possédant une première ainsi qu’une seconde face principale, d’un élément de circuit intégré radio fréquence noyé dans ce corps d’élément, et d’une antenne de bobine agencée sur ce corps d’élément. La bobine d’antenne est configurée par un premier motif de câblage formé sur la seconde face principale, une première broche métallique atteignant la première et la seconde face principale, une seconde broche métallique atteignant aussi la première et la seconde face principale, et un second motif de câblage formé sur la première face principale. Une face borne d’une première borne entrée/sortie et d’une seconde borne entrée/sortie de l’élément de circuit intégré radio fréquence est placée à la fois en opposition avec la seconde face principale du corps d’élément et à distance de la bobine d’antenne, et simultanément est connectée au premier motif de câblage par l’intermédiaire d’un premier ainsi que d’un second conducteur se prolongeant dans une direction de la seconde face principale du corps d’élément vers la première face principale.
(JA)
 RFIC素子によるアンテナコイルの磁界の妨げを少なくし、優れた電気特性を有する無線ICデバイス、それを備えた樹脂成型体、それを備えた通信端末装置、及びその製造方法を提供する。本発明の無線ICデバイスは、第1主面と第2主面とを有する素体、素体に埋設されたRFIC素子と、素体に設けられたアンテナコイルと、を備える。アンテナコイルは、第2主面に形成される第1配線パターンと、第1主面及び第2主面に達する第1金属ピンと、第1主面及び第2主面に達する第2金属ピンと、第1主面に形成される第2配線パターンにより構成される。RFIC素子の第1入出力端子及び第2入出力端子の端子面は、素体の第2主面に対向して配置されると共に、アンテナコイルから離れて配置される一方、素体の第2主面から第1主面の方向に延びる第1導体及び第2導体を介して第1配線パターンに接続される。
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