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1. WO2016141675 - WET ETCHING EQUIPMENT

Publication Number WO/2016/141675
Publication Date 15.09.2016
International Application No. PCT/CN2015/087022
International Filing Date 14.08.2015
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
CPC
H01L 21/30604
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
30604Chemical etching
H01L 21/67023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67023for general liquid treatment, e.g. etching followed by cleaning
H01L 21/6708
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67063for etching
67075for wet etching
6708using mainly spraying means, e.g. nozzles
H01L 21/67173
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67161characterized by the layout of the process chambers
67173in-line arrangement
H01L 21/6776
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 薛大鹏 XUE, Dapeng
Agents
  • 中国专利代理(香港)有限公司 CHINA PATENT AGENT (H.K.) LTD.
Priority Data
201510107896.812.03.2015CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) WET ETCHING EQUIPMENT
(FR) ÉQUIPEMENT DE GRAVURE PAR VOIE HUMIDE
(ZH) 湿法刻蚀设备
Abstract
(EN)
Provided is wet etching equipment. The wet etching equipment comprises an etching cavity (200) having an etching cavity inlet (203) located at the front end and an etching cavity outlet (204) located at the rear end, wherein inside the etching cavity (200), a thin film to be etched on a substrate (400) is etched by an etching liquid; and a decrystallization device (500) which cleans the residual etching liquid or an etching liquid crystal (601) formed from the etching liquid at the etching cavity inlet (203) and/or the etching cavity outlet (204) using a cleaning liquid. With the decrystallization device, the present invention can effectively remove the residual etching liquid or the etching liquid crystal formed from the etching liquid at the etching cavity inlet and the etching cavity outlet, thereby improving the utilization and cleanliness of the equipment and the product quality.
(FR)
La présente invention porte sur un équipement de gravure par voie humide. L'équipement de gravure par voie humide comprend une cavité de gravure (200) ayant une entrée de cavité de gravure (203) positionnée au niveau de l'extrémité avant et une sortie de cavité de gravure (204) positionnée au niveau de l'extrémité arrière, à l'intérieur de la cavité de gravure (200), un film mince à graver sur un substrat (400) étant gravée par un liquide de gravure ; et un dispositif de décristallisation (500) qui nettoie le liquide de gravure résiduel ou un cristal de liquide de gravure (601) formé à partir du liquide de gravure au niveau de l'entrée de cavité de gravure (203) et/ou de la sortie de cavité de gravure (204) à l'aide d'un liquide de nettoyage. Avec le dispositif d'une décristallisation, la présente invention peut éliminer de manière efficace le liquide de gravure résiduel ou le cristal de liquide de gravure formé à partir du liquide de gravure au niveau de l'entrée de cavité de gravure et de la sortie de cavité de gravure, ce qui permet d'améliorer l'utilisation et la propreté de l'équipement et la qualité de produit.
(ZH)
一种湿法刻蚀设备。该湿法刻蚀设备包括:刻蚀腔(200),其具有位于前端的刻蚀腔入口(203)和位于后端的刻蚀腔出口(204),其中在该刻蚀腔(200)内,基片(400)上的待刻蚀薄膜通过刻蚀液进行刻蚀;以及去结晶装置(500),其利用清洗液清洗在刻蚀腔入口(203)和/或刻蚀腔出口(204)处残留的刻蚀液或由刻蚀液形成的刻蚀液结晶(601)。本发明通过去结晶装置,可有效去除在刻蚀腔入口和刻蚀腔出口处残留的刻蚀液或由刻蚀液形成的刻蚀液结晶,藉此提高设备的稼动率和洁净度以及产品质量。
Also published as
Latest bibliographic data on file with the International Bureau