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1. WO2016135341 - DEBONDABLE REACTIVE HOT MELT ADHESIVES

Publication Number WO/2016/135341
Publication Date 01.09.2016
International Application No. PCT/EP2016/054229
International Filing Date 29.02.2016
IPC
C09J 175/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
02Polyureas
CPC
C07C 309/66
CCHEMISTRY; METALLURGY
07ORGANIC CHEMISTRY
CACYCLIC OR CARBOCYCLIC COMPOUNDS
309Sulfonic acids; Halides, esters, or anhydrides thereof
63Esters of sulfonic acids
64having sulfur atoms of esterified sulfo groups bound to acyclic carbon atoms
65of a saturated carbon skeleton
66Methanesulfonates
C08G 65/2615
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
26from cyclic ethers and other compounds
2603the other compounds containing oxygen
2615the other compounds containing carboxylic acid, ester or anhydride groups
C08K 5/1575
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
15Heterocyclic compounds having oxygen in the ring
156having two oxygen atoms in the ring
1575Six-membered rings
C08K 5/42
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
36Sulfur-, selenium-, or tellurium-containing compounds
41Compounds containing sulfur bound to oxygen
42Sulfonic acids; Derivatives thereof
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
Applicants
  • HENKEL AG & CO. KGAA [DE]/[DE]
Inventors
  • HEUCHER, Reimar
  • FORD, Isabelle
  • JOSEPH, Julie
  • CRAWFORD, Alasdair
Priority Data
15157011.627.02.2015EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DEBONDABLE REACTIVE HOT MELT ADHESIVES
(FR) ADHÉSIFS THERMOFUSIBLES RÉACTIFS DÉCOLLABLES
Abstract
(EN)
The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition.
(FR)
La présente invention concerne une composition d'adhésif thermofusible réactif, qui perd au moins partiellement son adhésivité après application d'une tension électrique et permet ainsi de décoller des substrats qui ont été collés à l'aide dudit adhésif. En outre, la présente invention concerne un procédé pour sa production et un procédé de formation d'un substrat collé à l'aide de ladite composition d'adhésif thermofusible réactif.
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