Processing

Please wait...

Settings

Settings

Goto Application

1. WO2016129373 - PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED

Publication Number WO/2016/129373
Publication Date 18.08.2016
International Application No. PCT/JP2016/052017
International Filing Date 25.01.2016
IPC
C23C 18/20 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
H05K 3/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
CPC
C23C 18/1882
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1875only one step pretreatment
1882Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
C23C 18/2066
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2053only one step pretreatment
2066Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
C23C 18/2086
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
2086with use of organic or inorganic compounds other than metals, first
C23C 18/22
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
22Roughening, e.g. by etching
C23C 18/38
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
38Coating with copper
Applicants
  • 上村工業株式会社 C. UYEMURA & CO., LTD. [JP]/[JP]
Inventors
  • 西條 義司 SAIJO, Yoshikazu
  • 山本 久光 YAMAMOTO, Hisamitsu
  • 石田 哲司 ISHIDA, Tetsuji
  • 米田 拓也 KOMEDA, Takuya
  • 内海 雅之 UTSUMI, Masayuki
Agents
  • 植木 久一 UEKI, Kyuichi
Priority Data
2015-02517812.02.2015JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED
(FR) AGENT DE PRÉTRAITEMENT POUR DÉPÔT AUTOCATALYTIQUE ET PROCÉDÉ DE PRÉTRAITEMENT ET PROCÉDÉ DE FABRICATION POUR CARTE DE CIRCUIT IMPRIMÉ DANS LAQUELLE EST UTILISÉ L'AGENT DE PRÉTRAITEMENT POUR DÉPÔT AUTOCATALYTIQUE
(JA) 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法
Abstract
(EN) Provided is a novel pretreatment agent for electroless plating, not only having excellent adsorption of a catalyst used prior to electroless plating, but also having excellent anti-foaming properties whereby bubble formation is suppressed in a short time, and excellent permeability to a substrate. This pretreatment agent for electroless plating contains a silane coupling agent, a surfactant, an ethylene glycol butyl ether represented by the formula C4H9-(OC2H4)n-OH (n = an integer of 1-4), and/or a propylene glycol butyl ether represented by the formula C4H9-(OC3H6)n-OH (n = an integer of 1-4).
(FR) L'invention concerne un nouvel agent de prétraitement destiné à un dépôt autocatalytique, qui présente non seulement une excellente adsorption d'un catalyseur utilisé avant le dépôt autocatalytique mais qui a également d'excellentes propriétés anti-moussantes, moyennant quoi la formation de bulles est supprimée rapidement et l'agent donne une excellente perméabilité à un substrat. L'agent de prétraitement destiné à un dépôt autocatalytique selon l'invention contient un agent de couplage au silane, un agent tensioactif, un éther butylique de l'éthylène-glycol représenté par la formule C4H9-(OC2H4)n-OH (n = un nombre entier compris entre 1 et 4) et/ou un éther butylique du propylène glycol représenté par la formule C4H9-(OC3H6)n-OH (n = un nombre entier compris entre 1 et 4).
(JA)  無電解めっきの前に用いられる触媒の吸着能に優れるだけでなく、泡の発生を短時間に抑えられて耐起泡性に優れており、且つ、基板への浸透性にも優れる新規な無電解めっき用前処理剤を提供する。本発明の無電解めっき用前処理剤は、シランカップリング剤と;界面活性剤と;C49-(OC24)n-OH(n=1~4の整数)で表されるエチレン系グリコールブチルエーテル、および/またはC49-(OC36)n-OH(n=1~4の整数)で表されるプロピレン系グリコールブチルエーテルを含有する。
Latest bibliographic data on file with the International Bureau