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1. (WO2016105134) ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/105134    International Application No.:    PCT/KR2015/014199
Publication Date: 30.06.2016 International Filing Date: 23.12.2015
IPC:
C09J 11/06 (2006.01), C09J 201/00 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu Seoul 07336 (KR)
Inventors: KIM, Hee Jung; (KR).
KIM, Jung Hak; (KR).
LEE, Kwang Joo; (KR).
KIM, Se Ra; (KR).
KIM, Young Kook; (KR).
NAM, Seung Hee; (KR).
HAN, Ji Ho; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro, Gangnam-gu Seoul 06134 (KR)
Priority Data:
10-2014-0188717 24.12.2014 KR
10-2015-0184155 22.12.2015 KR
Title (EN) ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE ADHÉSIVE POUR SEMI-CONDUCTEUR, FILM ADHÉSIF, FILM DE DÉCOUPAGE EN PUCES/FIXATION DE PUCES, ET DISPOSITIF SEMI-CONDUCTEUR
(KO) 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
Abstract: front page image
(EN)The present invention relates to an adhesive resin composition for semiconductor, the composition containing: a thermoplastic resin with a low moisture absorption rate; an epoxy resin including a biphenyl-based epoxy resin; and a hardener including a phenol resin, the content of the biphenyl-based epoxy resin in solids being 5 wt% to 25 wt%, to an adhesive film comprising a hardened material of the adhesive resin composition for semiconductor, to a dicing die bonding film comprising a base film, an adhesive layer formed on the base film, and a bonding layer formed on the adhesive layer and containing the adhesive resin composition for semiconductor, and to a semiconductor device comprising the adhesive film.
(FR)La présente invention concerne une composition de résine adhésive pour semi-conducteur, la composition contenant : une résine thermoplastique ayant un faible taux d'absorption d'humidité; une résine époxyde comprenant une résine époxyde à base de biphényle; et un durcisseur comprenant une résine phénol, la teneur de la résine époxyde à base de biphényle dans les matières solides étant de 5 % en poids à 25 % en poids, un film adhésif comprenant un matériau durci de la composition de résine adhésive pour semi-conducteur, un film de découpage en puces/fixation de puces comprenant un film de base, une couche adhésive formée sur le film de base, et une couche de liaison formée sur la couche adhésive et contenant la composition de résine adhésive pour semi-conducteur, et un dispositif semi-conducteur comprenant le film adhésif.
(KO)본 발명은 낮은 흡습율을 갖는 열가소성 수지; 바이페닐계 에폭시 수지를 포함하는 에폭시 수지; 및 페놀 수지를 포함한 경화제;를 포함하고,고형분 중 상기 바이페닐계 에폭시 수지의 함량이 5 중량 % 내지 25중량 %인 반도체 접착용 수지 조성물과, 상기 반도체 접착용 수지 조성물의 경화물을 포함한 접착 필름과, 기재 필름 상기 기재 필름 상에 형성되는 점착층 및 상기 점착층상에 형성되고 상기 반도체 접착용 수지 조성물을 포함한 접착층을 포함한 다이싱 다이본딩 필름과, 상기 접착 필름을 포함한 반도체 소자에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)