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Machine translation
1. (WO2016105131) METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/105131    International Application No.:    PCT/KR2015/014195
Publication Date: 30.06.2016 International Filing Date: 23.12.2015
IPC:
B32B 37/12 (2006.01), B32B 37/26 (2006.01), B32B 15/08 (2006.01), B32B 15/20 (2006.01), H05K 9/00 (2006.01)
Applicants: DOOSAN CORPORATION [KR/KR]; 275 Jangchungdan-ro Jung-gu Seoul 04563 (KR)
Inventors: PARK, Hansung; (KR).
CHO, Kyeongwoon; (KR).
KIM, Woojeong; (KR).
LYU, Jungsup; (KR)
Agent: HANBEOT PATENT & LAW FIRM; 15th Fl. Salvation Army Bldg. 7, Chungjeong-ro Seodaemun-gu Seoul 03737 (KR)
Priority Data:
10-2014-0188646 24.12.2014 KR
Title (EN) METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD
(FR) PROCÉDÉ DE FABRICATION D'UN FILM DE BLINDAGE CONTRE LES ONDES ÉLECTROMAGNÉTIQUES POUR CARTE DE CIRCUITS IMPRIMÉS SOUPLE
(KO) 연성 인쇄회로기판용 전자파 차폐 필름의 제조방법
Abstract: front page image
(EN)The present invention provides a method for manufacturing an electromagnetic wave shielding film comprising the steps of: (i) forming an insulation layer by coating a thermosetting resin composition for forming an insulation layer on a first surface of a first base film; (ii) laminating a peelable double-layer copper foil comprising a second copper foil, an adhesive layer and a first carrier copper foil on the insulation layer, wherein the first carrier copper foil is detached after coupling the insulation layer and the second copper foil; (iii) forming a conductive adhesive layer by coating a resin composition comprising a conductive filler and a thermosetting resin for forming a conductive adhesive layer on a first surface of a second base film, and then drying the same; and (iv) laminating the first base film and the second base film, wherein the second copper foil of the first base film and the conductive adhesive layer of the second base film are arranged so as to be adjoined and then compressed through a pressurisation process. The present invention can minimise the loss of source materials resulting from repetitively performing multiple coating processes so as to form a plurality of coating layers when an electromagnetic wave shielding film is conventionally manufactured, and can enhance economic feasibility by simplifying the manufacturing process.
(FR)La présente invention concerne un procédé de fabrication d'un film de blindage contre les ondes électromagnétiques, ledit procédé consistant : (i) à former une couche d'isolation en revêtant une première surface d'un premier film de base d'une composition de résine thermodurcissable pour former une couche d'isolation ; (ii) à stratifier une couche de cuivre double feuille pouvant être décollée comprenant une seconde feuille de cuivre, une couche adhésive et une première feuille de cuivre porteuse sur la couche d'isolation, la première feuille de cuivre porteuse étant détachée après le couplage de la couche d'isolation et de la seconde feuille de cuivre ; (iii) à former une couche adhésive conductrice en revêtant une première surface d'un second film de base d'une composition de résine comprenant une charge conductrice et une résine thermodurcissable pour former une couche adhésive conductrice, puis à sécher celle-ci ; (iv) à stratifier le premier film de base et le second film de base, la seconde feuille de cuivre du premier film de base et la couche adhésive conductrice du second film de base étant agencées de manière à être réunies, puis comprimées à l'aide d'un processus de pressurisation. La présente invention peut réduire à un minimum la perte de matériaux source résultant de l'exécution répétitive de multiples processus de revêtement de façon à former une pluralité de couches de revêtement quand un film de blindage contre les ondes électromagnétiques est fabriqué de manière classique, et peut améliorer la viabilité économique par simplification du processus de fabrication.
(KO)본 발명은 (i) 제1기재필름의 제1면 상에 절연층 형성용 열경화성 수지 조성물을 코팅하여 절연층을 형성하는 단계; (ii) 상기 절연층 상에 제2동박, 점착층 및 캐리어 제1동박으로 구성되는 분리형(peelable) 이중층 동박을 적층하되, 절연층과 제2동박을 접합한 후 상기 캐리어 제1동박을 탈착하는 단계; (iii) 제2기재필름의 제1면 상에 도전성 필러 및 열경화성 수지를 포함하는 전도성 접착층 형성용 수지 조성물을 코팅한 후 건조하여 전도성 접착층을 형성하는 단계; 및 (iv) 제1기재필름과 제2기재필름을 적층하되, 상기 제1기재필름의 제2동박과 제2기재필름의 전도성 접착층이 서로 접하도록 배치한 후 가압 공정을 통해 압착하는 단계를 포함하는 전자파 차폐 필름의 제조방법을 제공한다. 본 발명에서는 종래 전자파 차폐필름 제조시, 복수의 코팅층을 형성하기 위해 멀티코팅 공정을 반복 수행함에 따라 초래되는 원재료의 손실을 최소화할 뿐만 아니라 제조공정의 단순화를 도모하여 경제성을 높일 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)