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1. (WO2016104788) EPOXY RESIN MOLDING MATERIAL, MOLDED ARTICLE, MOLDED CURED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/104788    International Application No.:    PCT/JP2015/086414
Publication Date: 30.06.2016 International Filing Date: 25.12.2015
IPC:
C08L 63/00 (2006.01), C08G 59/24 (2006.01), C08G 59/62 (2006.01), C08J 5/00 (2006.01), C08K 3/20 (2006.01), C08K 5/54 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: TANAKA, Kenji; (JP).
YOSHIDA, Yuka; (JP).
KOSUGI, Shinichi; (JP).
KATAGI, Hideyuki; (JP).
SUE, Haruaki; (JP).
TAKEZAWA, Yoshitaka; (JP)
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2014-266106 26.12.2014 JP
Title (EN) EPOXY RESIN MOLDING MATERIAL, MOLDED ARTICLE, MOLDED CURED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE
(FR) MATÉRIAU DE MOULAGE À BASE DE RÉSINE ÉPOXY, ARTICLE MOULÉ, ARTICLE MOULÉ DURCI ET PROCÉDÉ DE FABRICATION D'UN ARTICLE MOULÉ
(JA) エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法
Abstract: front page image
(EN)Provided is an epoxy resin molding material comprising: an epoxy resin A which has a mesogenic skeleton and a phase transition temperature of less than 140°C; a curing agent; and an inorganic filler.
(FR)L'invention concerne un matériau de moulage à base de résine époxy comprenant : une résine époxy A à squelette mésogène et dont la température de transition de phase est inférieure à 140 °C ; un agent de durcissement ; et une charge inorganique.
(JA) エポキシ樹脂成形材料は、メソゲン骨格を有し且つ相転移温度が140℃未満のエポキシ樹脂Aと、硬化剤と、無機充填材と、を含有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)