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Pub. No.:    WO/2016/104598    International Application No.:    PCT/JP2015/086020
Publication Date: 30.06.2016 International Filing Date: 24.12.2015
H03H 9/145 (2006.01)
Applicants: KYOCERA CORPORATION [JP/JP]; 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501 (JP)
Inventors: URATA, Tomonori; (JP)
Agent: SATOH, TAKAHISA; Sohshin International Patent Office, SS building 2F, 4-2, Nishi-Shinbashi 3-chome, Minato-ku, Tokyo 1050003 (JP)
Priority Data:
2014-265333 26.12.2014 JP
(JA) 弾性波装置
Abstract: front page image
(EN)An SAW device 1 comprises: a piezoelectric substrate 13; an IDT electrode 5 that is disposed on a first main surface 3a of the piezoelectric substrate 13; a capacitive element 31 that is disposed on the first main surface 3a and is connected to the IDT electrode 5; and a cover 9 that covers only the capacitive element 31 among the IDT electrode 5 and the capacitive element 31.
(FR)Un dispositif SAW comprend : un substrat piézoélectrique 13; une électrode IDT 5 disposée sur une première surface principale 3a du substrat piézoélectrique 13; un élément capacitif 31 disposé sur la première surface principale 3a et connecté à l'électrode IDT 5; et un couvercle 9 recouvrant uniquement l'élément capacitif 31 entre l'électrode IDT 5 et l'élément capacitif 31.
(JA) SAW装置1は、圧電基板13と、圧電基板13の第1主面3aに位置するIDT電極5と、第1主面3aに位置し、IDT電極5に接続された容量素子31と、IDT電極5および容量素子31のうち容量素子31のみに重なるカバー9と、を有している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)