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Machine translation
1. (WO2016098499) SUPPORT GLASS SUBSTRATE AND LAMINATE USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/098499    International Application No.:    PCT/JP2015/081983
Publication Date: 23.06.2016 International Filing Date: 13.11.2015
IPC:
C03C 3/083 (2006.01), C03B 17/00 (2006.01), C03C 3/085 (2006.01), C03C 3/087 (2006.01), C03C 3/091 (2006.01), C03C 3/093 (2006.01), H01L 21/02 (2006.01), H01L 21/683 (2006.01)
Applicants: NIPPON ELECTRIC GLASS CO., LTD. [JP/JP]; 7-1, Seiran 2-chome, Otsu-shi Shiga 5208639 (JP)
Inventors: SUZUKI Ryota; (JP).
TAKAHASHI Takahiro; (JP)
Priority Data:
2014-253574 16.12.2014 JP
2015-031496 20.02.2015 JP
2015-197313 05.10.2015 JP
Title (EN) SUPPORT GLASS SUBSTRATE AND LAMINATE USING SAME
(FR) SUBSTRAT SUPPORT EN VERRE ET STRATIFIÉ L'UTILISANT
(JA) 支持ガラス基板及びこれを用いた積層体
Abstract: front page image
(EN)The present invention addresses a technical problem of producing a support substrate that is less likely to cause a change in dimension of a processing substrate and a laminate using the support substrate, and thereby contributing to high-density mounting of a semiconductor package. The present invention is characterized in that the average coefficient of linear thermal expansion in a temperature range from 20 to 200°C is more than 110 × 10-7/°C and not more than 160 × 10-7/°C.
(FR)La présente invention concerne un problème technique de production d'un substrat support qui est moins susceptible de provoquer un changement de dimension d'un substrat de traitement et un stratifié utilisant le substrat support, et contribuant ainsi à un montage à haute densité d'un boîtier de semi-conducteur. La présente invention est caractérisée en ce que le coefficient moyen de dilatation thermique linéaire dans une plage de température allant de 20 à 200 °C est supérieur à 110 × 10-7/°C et d'au plus 160 x 10-7/°C.
(JA) 本発明の技術的課題は、加工基板の寸法変化を生じさせ難い支持基板及びこれを用いた積層体を創案することにより、半導体パッケージの高密度実装に寄与する。本発明は、20~200℃の温度範囲における平均線熱膨張係数が110×10-7/℃超であり、且つ160×10-7/℃以下であることを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)