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1. (WO2016098314) ADHESION LAYER COMPOSITION, METHODS FOR FORMING ADHESION LAYER AND CURED PRODUCT PATTERN, AND METHODS FOR MANUFACTURING OPTICAL COMPONENT, CIRCUIT BOARD, IMPRINTING MOLD AND DEVICE COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/098314    International Application No.:    PCT/JP2015/006106
Publication Date: 23.06.2016 International Filing Date: 08.12.2015
IPC:
H01L 21/027 (2006.01), B29C 59/02 (2006.01), C08G 75/04 (2016.01)
Applicants: CANON KABUSHIKI KAISHA [JP/JP]; 30-2, Shimomaruko 3-chome, Ohta-ku, Tokyo 1468501 (JP)
Inventors: OTANI, Tomonori; (JP).
ITO, Toshiki; (JP).
HONMA, Takeshi; (JP)
Agent: ABE, Takuma; (JP)
Priority Data:
2014-253531 15.12.2014 JP
2015-187477 24.09.2015 JP
Title (EN) ADHESION LAYER COMPOSITION, METHODS FOR FORMING ADHESION LAYER AND CURED PRODUCT PATTERN, AND METHODS FOR MANUFACTURING OPTICAL COMPONENT, CIRCUIT BOARD, IMPRINTING MOLD AND DEVICE COMPONENT
(FR) COMPOSITION DE COUCHE D'ADHÉSION, PROCÉDÉS DE FORMATION DE COUCHE D'ADHÉSION ET MOTIF DE PRODUIT DURCI, ET PROCÉDÉS DE FABRICATION D'UN COMPOSANT OPTIQUE, CARTE DE CIRCUIT IMPRIMÉ, MOULE D'IMPRESSION ET COMPOSANT DE DISPOSITIF
Abstract: front page image
(EN)An adhesion layer composition contains a compound (A) having at least three ethylenic unsaturated groups in the molecule thereof, and a compound (B) having at least two thiol groups in the molecule thereof.
(FR)L'invention concerne une composition de couche d'adhésion qui contient un composé (A) ayant au moins trois groupes insaturés éthyléniques dans sa molécule, et un composé (B) ayant au moins deux groupes thiol dans sa molécule.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)