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1. (WO2016092718) PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COATED PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/092718    International Application No.:    PCT/JP2015/004080
Publication Date: 16.06.2016 International Filing Date: 17.08.2015
IPC:
G03F 7/004 (2006.01), G03F 7/029 (2006.01), G03F 7/031 (2006.01)
Applicants: GOO CHEMICAL CO., LTD. [JP/JP]; 58, Ijiri, Iseda-cho, Uji-shi, Kyoto 6110043 (JP)
Inventors: SAKAI, Yoshio; (JP)
Agent: NISHIKAWA, Yoshikiyo; (JP)
Priority Data:
PCT/JP2014/006157 10.12.2014 JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COATED PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, COMPOSITION D'ÉPARGNE DE SOUDAGE, ET CARTE IMPRIMÉE REVÊTUE
(JA) 感光性樹脂組成物、ソルダーレジスト組成物及び被覆プリント配線板
Abstract: front page image
(EN)A photosensitive resin composition according to the present invention comprises (A) a photopolymerizable compound containing at least one of a photopolymerizable monomer and a photopolymerizable oligomer, (B) titanium oxide, and (C) a photopolymerization initiator. The (C) component contains (C1) an acylphosphine oxide photopolymerization initiator and (C2) a phenylglyoxylate photopolymerization initiator.
(FR)Une composition de résine photosensible selon la présente invention comprend (A) un composé photopolymérisable contenant au moins un élément sélectionné parmi un monomère photopolymérisable et un oligomère photopolymérisable, (B) de l'oxyde de titane, et (C) un initiateur de photopolymérisation. Le composant (C) contient (C1) un initiateur de photopolymérisation d'oxyde d'acylphosphine et (C2) un initiateur de photopolymérisation de phénylglyoxylate.
(JA)本発明に係る感光性樹脂組成物は、(A)光重合性モノマーと光重合性オリゴマーとのうち少なくとも一方を含む光重合性化合物、(B)酸化チタン及び(C)光重合開始剤を含有する。(C)成分が、(C1)アシルフォスフィンオキサイド系光重合開始剤及び(C2)フェニルグリオキシレート系光重合開始剤を含有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)