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Machine translation
1. (WO2016092633) SEMICONDUCTOR PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/092633    International Application No.:    PCT/JP2014/082544
Publication Date: 16.06.2016 International Filing Date: 09.12.2014
IPC:
H01L 23/28 (2006.01), H01L 23/50 (2006.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310 (JP)
Inventors: MIZUTANI, Hiroyuki; (JP).
ISHIBASHI, Hidenori; (JP).
YOSHIOKA, Hideharu; (JP).
ISHIDA, Kiyoshi; (JP)
Agent: TAZAWA, Hideaki; (JP)
Priority Data:
Title (EN) SEMICONDUCTOR PACKAGE
(FR) BOÎTIER DE SEMI-CONDUCTEUR
(JA) 半導体パッケージ
Abstract: front page image
(EN)A lead frame of the present invention has a terminal 4, which is disposed such that the terminal surrounds a terminal 3 on a package surface, and which can be grounded, and the lead frame is provided with a conductor film 7, which covers a molded resin 6, and which is electrically connected to the terminal 4.
(FR)Une grille de connexion de la présente invention comporte une borne 4, qui est disposée de telle sorte que la borne entoure une borne 3 sur une surface du boîtier, et qui peut être mise à la terre, et la grille de connexion est pourvue d'un film conducteur 7, qui recouvre une résine moulée 6, et qui est électriquement connecté à la borne 4.
(JA) リードフレームは、パッケージ面において端子3を囲むように配置され、接地可能な端子4を有し、また、モールド樹脂6を覆い、端子4に電気的に接続された導体膜7を備えた。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)