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Machine translation
1. (WO2016091438) SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRIC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/091438    International Application No.:    PCT/EP2015/074148
Publication Date: 16.06.2016 International Filing Date: 19.10.2015
IPC:
H01L 23/00 (2006.01), H03H 9/10 (2006.01), H04R 19/04 (2006.01)
Applicants: SnapTrack, Inc. [US/US]; 5775 Morehouse Drive San Diego, CA 92121 (US)
Inventors: BAUER, Christian; (DE).
KRÜGER, Hans; (DE).
PORTMANN, Jürgen; (DE).
STELZL, Alois; (DE).
PAHL, Wolfgang; (DE)
Agent: BARDEHLE PAGENBERG PARTNERSCHAFT MBB; Postfach 86 06 20 81633 München (DE)
Priority Data:
102014118214.6 09.12.2014 DE
Title (DE) EINFACH HERSTELLBARES ELEKTRISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES ELEKTRISCHEN BAUELEMENTS
(EN) SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRIC COMPONENT
(FR) COMPOSANT ÉLECTRIQUE FACILE À FABRIQUER ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT ÉLECTRIQUE
Abstract: front page image
(DE)Es wird ein einfach herzustellendes elektrisches Bauelement für Chips mit empfindlichen Bauelementstrukturen angegeben. Das Bauelement umfasst eine Verbindungsstruktur und eine Verschaltungsstruktur an der Unterseite des Chips und ein Trägersubstrat mit zumindest einer Polymerlage.
(EN)The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.
(FR)L'invention concerne un composant électrique facile à fabriquer pour des puces ayant des structures de composant sensibles. Le composant comprend une structure de liaison et une structure de connexion sur le côté inférieur de la puce ainsi qu'un substrat porteur pourvu d'au moins une couche de polymère.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: German (DE)
Filing Language: German (DE)