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1. (WO2016089840) COMPOSITIONALLY MATCHED MOLECULAR SOLDERS FOR SEMICONDUCTORS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/089840    International Application No.:    PCT/US2015/063145
Publication Date: 09.06.2016 International Filing Date: 01.12.2015
IPC:
H01L 21/60 (2006.01), H01L 23/48 (2006.01)
Applicants: THE UNIVERSITY OF CHICAGO [US/US]; 5801 South Ellis Avenue Chicago, Illinois 60637 (US)
Inventors: DOLZHNIKOV, Dmitriy S.; (US).
ZHANG, Hao; (US).
JANG, Jaeyoung; (US).
SON, Jae Sung; (KR).
PANTHANI, Matthew G.; (US).
TALAPIN, Dmitri V.; (US)
Agent: MANNING, Michelle; (US)
Priority Data:
62/085,966 01.12.2014 US
Title (EN) COMPOSITIONALLY MATCHED MOLECULAR SOLDERS FOR SEMICONDUCTORS
(FR) SOUDURES MOLÉCULAIRES À COMPOSITION ADAPTÉE POUR SEMI-CONDUCTEURS
Abstract: front page image
(EN)Chalcogenidometallates of group IIB, IV and V elements and, particularly, alkali metal-containing chalcogenidometallates of cadmium, lead and bismuth are provided. Also provided are methods of using the chalcogenidometallates as molecular solders to form metal chalcogenide structures, including thin films, molded objects and bonded surfaces composed of metal chalcogenides.
(FR)L'invention concerne des chalcogénidométallates d'éléments du groupe IIB, IV et V et, en particulier, des chalcogénidométallates contenant un métal alcalin de cadmium, de plomb et de bismuth. L'invention concerne également des procédés d'utilisation de chalcogénidométallates en tant que soudures moléculaires pour former des structures de chalcogénure métallique, notamment des films minces, des objets moulés et des surfaces liées constituées de chalcogénures métalliques.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)