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1. (WO2016088417) LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/088417    International Application No.:    PCT/JP2015/074850
Publication Date: 09.06.2016 International Filing Date: 01.09.2015
IPC:
C08L 63/00 (2006.01), C08K 9/06 (2006.01), H01L 21/60 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01)
Applicants: NAMICS CORPORATION [JP/JP]; 3993 Nigorikawa, Kita-ku, Niigata-shi, Niigata 9503131 (JP)
Inventors: YAMAZAWA Tomoya; (JP).
YOSHII Haruyuki; (JP)
Agent: WATANABE Mochitoshi; (JP)
Priority Data:
2014-244026 02.12.2014 JP
Title (EN) LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME
(FR) MATÉRIAU D'ÉTANCHÉITÉ LIQUIDE POUR BOSSE DE CUIVRE ET COMPOSITION DE RÉSINE UTILE EN TANT QUE TEL
(JA) 銅バンプ用液状封止材、および、それに用いる樹脂組成物
Abstract: front page image
(EN)Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).
(FR)L'invention concerne un matériau d'étanchéité liquide pour bosses de cuivre qui ne subit pas de séparation de la charge pendant le durcissement thermique, provoquant le craquage de la bosse. L'invention concerne également une composition de résine utile comme matériau d'étanchéité. La composition de résine selon la présente invention comprend (A) une résine époxyde liquide, (B) un durcisseur et (C) une charge d'alumine ayant une surface traitée avec l'agent de couplage au silane de la formule suivante (1).
(JA) 加熱硬化時におけるフィラーの分離、および、それによるバンプでのクラックの発生が抑制された、銅バンプ用液状封止材およびそれに用いる樹脂組成物を提供する。本発明の樹脂組成物は、(A)液状エポキシ樹脂、(B)硬化剤、および、(C)下記式(1)のシランカップリング剤で表面処理されたアルミナフィラーを含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)