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Machine translation
1. (WO2016088381) ELECTROMAGNETIC WAVE SHIELDING FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/088381    International Application No.:    PCT/JP2015/006013
Publication Date: 09.06.2016 International Filing Date: 03.12.2015
IPC:
H05K 9/00 (2006.01), C09J 7/02 (2006.01), C09J 201/00 (2006.01), H05K 1/02 (2006.01)
Applicants: TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP/JP]; 3-1, Iwata-cho 2-chome, Higashiosaka-shi, Osaka 5788585 (JP)
Inventors: IWAI, Yasushi; (JP).
YANAGI, Yoshiharu; (JP).
TAKESHITA, Shigeki; (JP)
Agent: MAEDA & PARTNERS; Shin-Daibiru Bldg. 23F, 2-1, Dojimahama 1-chome, Kita-ku, Osaka-shi, Osaka 5300004 (JP)
Priority Data:
2014-246778 05.12.2014 JP
Title (EN) ELECTROMAGNETIC WAVE SHIELDING FILM
(FR) FILM DE PROTECTION CONTRE LES ONDES ÉLECTROMAGNÉTIQUES
(JA) 電磁波シールドフィルム
Abstract: front page image
(EN)An electromagnetic wave shielding film is provided with an electroconductive shield layer 110 having protrusions and recesses, and an adhesive layer 120 for coating the protrusions and recesses. The maximum peak height of the protrusions and recesses is greater than the thickness of the adhesive layer 120.
(FR)L'invention concerne un film de protection contre les ondes électromagnétiques pourvu d'une couche de protection électroconductrice 110 ayant des saillies et des renfoncements, et une couche adhésive 120 pour le revêtement des saillies et des renfoncements. La hauteur maximale de pic des saillies et des renfoncements est supérieure à l'épaisseur de la couche adhésive 120.
(JA) 電磁波シールドフィルムは、凹凸を有する導電性のシールド層110と、凹凸を被覆する接着剤層120とを備えている。凹凸の最大山高さの値は、接着剤層120の厚さよりも大きい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)