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1. (WO2016085570) CONTACT WRAP AROUND STRUCTURE

Pub. No.:    WO/2016/085570    International Application No.:    PCT/US2015/053305
Publication Date: Jun 2, 2016 International Filing Date: Sep 30, 2015
IPC: H01L 29/417
H01L 29/66
H01L 29/78
Applicants: QUALCOMM INCORPORATED
Inventors: XU, Jeffrey Junhao
SONG, Stanley Seungchul
MACHKAOUTSAN, Valdimir
BADAROGLU, Mustafa
BAO, Junjing
ZHU, John Jianhong
YANG, Da
YEAP, Choh Fei
Title: CONTACT WRAP AROUND STRUCTURE
Abstract:
A semiconductor device includes a gate stack. The semiconductor device also includes a wrap-around contact arranged around and contacting substantially all surface area of a regrown source/drain region of the semiconductor device proximate to the gate stack.