WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2016085004) LAMINATED CERAMIC CHIP COMPONENT INCLUDING NANO THIN FILM LAYER, MANUFACTURING METHOD THEREFOR, AND ATOMIC LAYER VAPOR DEPOSITION APPARATUS THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/085004    International Application No.:    PCT/KR2014/011522
Publication Date: 02.06.2016 International Filing Date: 28.11.2014
IPC:
H01G 4/232 (2006.01), H01G 4/30 (2006.01), H01G 13/00 (2013.01)
Applicants: HONGIK UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION [KR/KR]; (Sangsu-dong, Munheongwan), 805-ho, 94, Wausan-ro Mapo-gu Seoul 121-791 (KR).
MAX TECH CO., LTD. [KR/KR]; (Samjeong-dong, Bucheon Technopark), 304-301, 302, 345, Seokcheon-ro, Ojeong-gu Bucheon-si Gyeonggi-do 421-741 (KR)
Inventors: HWANG, Jin Ha; (KR).
PARK, Dae Bum; (KR).
CHOO, Yong Jo; (KR).
KIM, Hyun Suk; (KR).
PARK, Da Hee; (KR).
KO, Myeong Hee; (KR).
KWON, Kyoung Woo; (KR).
HWANG, Hee Su; (KR).
CHOI, Jeong Wan; (KR)
Agent: KIM, Ho Jong; (KR)
Priority Data:
Title (EN) LAMINATED CERAMIC CHIP COMPONENT INCLUDING NANO THIN FILM LAYER, MANUFACTURING METHOD THEREFOR, AND ATOMIC LAYER VAPOR DEPOSITION APPARATUS THEREFOR
(FR) COMPOSANT DE PUCE EN CÉRAMIQUE STRATIFIÉ COMPRENANT UNE COUCHE DE FILM MINCE NANOMÉTRIQUE, SON PROCÉDÉ DE FABRICATION, ET APPAREIL DE DÉPÔT EN PHASE VAPEUR DE COUCHE ATOMIQUE ASSOCIÉ
(KO) 나노 박막층을 구비하는 적층 세라믹 칩 부품과 이의 제조 방법 및 이를 위한 원자층 증착 장치
Abstract: front page image
(EN)A laminated ceramic chip component including a nano thin film layer, a manufacturing method therefor, and an atomic layer vapor deposition apparatus therefor are disclosed. The laminated ceramic chip component comprises: a device that includes a ceramic main body and an internal electrode located inside the ceramic main body; an external electrode unit that includes first and second external electrodes that include side electrodes that cover the opposite side surfaces of the ceramic main body, upper electrodes that partially cover the opposite sides of the upper surface of the ceramic main body, and lower electrodes that partially cover the opposite sides of the lower surface of the ceramic main body; and a nano thin film layer formed of an electrical insulating material and coated on a region that includes the upper electrode.
(FR)La présente invention concerne un composant de puce en céramique stratifié comprenant une couche de film mince nanométrique, son procédé de fabrication et un appareil de dépôt en phase vapeur de couche atomique associé. Le composant de puce en céramique stratifié comprend : un dispositif qui comprend un corps principal en céramique et une électrode interne située à l'intérieur du corps principal en céramique ; une unité d'électrodes externes qui comprend des première et seconde électrodes externes qui comprennent des électrodes latérales qui recouvrent les surfaces latérales opposées du corps principal en céramique, des électrodes supérieures qui recouvrent partiellement les côtés opposés de la surface supérieure du corps principal en céramique, et des électrodes inférieures qui recouvrent partiellement les côtés opposés de la surface inférieure du corps principal en céramique ; et une couche de film mince nanométrique constituée d'un matériau électriquement isolant et revêtant une zone qui comprend l'électrode supérieure.
(KO)본 발명은 세라믹 본체와 상기 세라믹 본체의 내부에 위치하는 내부 전극을 포함하는 소자부와, 상기 세라믹 본체의 양측면을 각각 덮는 측면 전극과 상면 양측의 일부를 각각 덮는 상부 전극 및 하면 양측의 일부를 각각 덮는 하부 전극을 구비하는 제 1 외부 전극 및 제 2 외부 전극을 포함하는 외부 전극부 및 전기 절연성 물질로 형성되며, 상기 상부 전극을 포함하는 영역에 코팅되어 형성되는 나노 박막층을 포함하는 나노 박막층을 구비하는 적층 세라믹 칩 부품과 이의 제조 방법 및 이를 위한 원자층 증착 장치를 개시한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)