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1. WO2016079627 - POLYMER COMPOSITE THERMAL INTERFACE MATERIAL WITH HIGH THERMAL CONDUCTIVITY

Publication Number WO/2016/079627
Publication Date 26.05.2016
International Application No. PCT/IB2015/058527
International Filing Date 04.11.2015
IPC
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
CPC
C08G 18/003
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
003with epoxy compounds having no active hydrogen
C08G 18/2027
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
08Processes
16Catalysts
18containing secondary or tertiary amines or salts thereof
20Heterocyclic amines; Salts thereof
2009containing one heterocyclic ring
2027having two nitrogen atoms in the ring
C08G 18/3206
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
30Low-molecular-weight compounds
32Polyhydroxy compounds; Polyamines; Hydroxyamines
3203Polyhydroxy compounds
3206aliphatic
C08G 18/4277
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
40High-molecular-weight compounds
42Polycondensates having carboxylic or carbonic ester groups in the main chain
4266prepared from hydroxycarboxylic acids and/or lactones
4269Lactones
4277Caprolactone and/or substituted caprolactone
C08G 18/6644
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
65Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
66Compounds of groups C08G18/42, C08G18/48, or C08G18/52
6633Compounds of group C08G18/42
6637with compounds of group C08G18/32 or polyamines of C08G18/38
664with compounds of group C08G18/3203
6644having at least three hydroxy groups
C08G 18/7671
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
70characterised by the isocyanates or isothiocyanates used
72Polyisocyanates or polyisothiocyanates
74cyclic
76aromatic
7657containing two or more aromatic rings
7664containing alkylene polyphenyl groups
7671containing only one alkylene bisphenyl group
Applicants
  • INTERNATIONAL BUSINESS MACHINES CORPORATION [US]/[US]
  • IBM UNITED KINGDOM LIMITED [GB]/[GB] (MG)
  • IBM JAPAN LIMITED [JP]/[JP] (MG)
Inventors
  • LIN, Wei
Agents
  • LITHERLAND, David
Priority Data
14/546,39418.11.2014US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) POLYMER COMPOSITE THERMAL INTERFACE MATERIAL WITH HIGH THERMAL CONDUCTIVITY
(FR) MATÉRIAU COMPOSITE POLYMÈRE D'INTERFACE THERMIQUE À HAUTE CONDUCTIVITÉ THERMIQUE
Abstract
(EN)
The present invention relates generally to thermally conductive adhesives for thermal interfaces in electronic packaging, and more particularly, to a polymer-based composite thermal interface material ("TIM") with an inter-penetrating network (IPN) polymer matrix consisting of polyurethane and an epoxy that is fully crosslinked. The IPN polymer matrix is designed to improve overall thermal conductivity by the altering the dispersion/distribution of thermally conductive fillers, the filler/polymer interfaces, and/or phonon scattering behaviors in the composite.
(FR)
La présente invention concerne en général des adhésifs thermoconducteurs pour interfaces thermiques dans un boîtier électronique et, plus particulièrement, un matériau composite d'interface thermique (TIM) à base de polymère avec une matrice polymère à enchevêtrement de réseaux (IPN) constituée de polyuréthane et d'une résine époxy qui est entièrement réticulée. La matrice polymère IPN est conçue pour améliorer la conductivité thermique globale par la modification de la dispersion/distribution de charges thermoconductrices, des interfaces charge/polymère, et/ou des comportements de diffusion de phonons dans le composite.
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