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1. (WO2016065200) SYSTEMS, APPARATUS, AND METHODS FOR PURGING A SUBSTRATE CARRIER AT A FACTORY INTERFACE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/065200 International Application No.: PCT/US2015/057005
Publication Date: 28.04.2016 International Filing Date: 22.10.2015
IPC:
H01L 21/677 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants: APPLIED MATERIALS, INC[US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors: IYER, Subramaniam V.; IN
SRICHURNAM, Dharma Ratnam; IN
HOLEYANNAVAR, Devendrappa; IN
MACLEOD, Douglas; US
CARPENTER, Kenneth; US
KUMAR, Naveen; IN
RAO, Vivek R.; IN
PANNESE, Patrick; US
Agent: DUGAN, Brian M.; US
Priority Data:
62/068,61724.10.2014US
Title (EN) SYSTEMS, APPARATUS, AND METHODS FOR PURGING A SUBSTRATE CARRIER AT A FACTORY INTERFACE
(FR) SYSTÈMES, APPAREIL ET PROCÉDÉS DE PURGE D'UN SUPPORT DE SUBSTRAT AU NIVEAU D'UNE INTERFACE D'USINE
Abstract:
(EN) Embodiments of the present invention provide systems, apparatus, and methods for purging a substrate carrier. Embodiments include a frame configured to sit proximate to a load port door without interfering with operation of a factory interface or equipment front end module robot; one or more inter-substrate nozzle arrays supported by the frame and configured to spray gas into a substrate carrier; and one or more curtain nozzle arrays supported by the frame and configured to spray gas across an opening of the substrate carrier. Numerous additional aspects are disclosed.
(FR) L'invention concerne, dans des modes de réalisation, des systèmes, un appareil et des procédés de purge d'un support de substrat. Des modes de réalisation comprennent un cadre conçu pour se loger à proximité d'une porte d'orifice de charge sans interférer avec l'opération d'un robot de module d'extrémité avant d'équipement ou d'interface d'usine ; un ou plusieurs réseaux de buse entre les substrats supportés par le cadre et conçus pour pulvériser du gaz dans un support de substrat ; et un ou plusieurs réseaux de buses en rideaux supportés par le cadre et conçus pour pulvériser du gaz à travers une ouverture du support de substrat. L'invention concerne également de nombreux aspects supplémentaires.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)