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1. (WO2016063506) RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/063506 International Application No.: PCT/JP2015/005225
Publication Date: 28.04.2016 International Filing Date: 16.10.2015
IPC:
C08L 63/00 (2006.01) ,C08G 59/40 (2006.01) ,C08J 5/24 (2006.01) ,C08K 5/09 (2006.01) ,C08L 25/08 (2006.01) ,C08L 35/00 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
09
Carboxylic acids; Metal salts thereof; Anhydrides thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02
Homopolymers or copolymers of hydrocarbons
04
Homopolymers or copolymers of styrene
08
Copolymers of styrene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
35
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
東田 利之 HIGASHIDA, Toshiyuki; null
元部 英次 MOTOBE, Hidetsugu; null
新居 大輔 NII, Daisuke; null
Agent:
鎌田 健司 KAMATA, Kenji; JP
Priority Data:
2014-21567222.10.2014JP
Title (EN) RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE, PRÉIMPRÉGNÉ, FEUILLE MÉTALLIQUE COMPRENANT DE LA RÉSINE, PLAQUE STRATIFIÉE À REVÊTEMENT MÉTALLIQUE ET CARTE DE CIRCUIT IMPRIMÉ
(JA) 樹脂組成物、プリプレグ、樹脂付き金属箔、金属張及び積層板及びプリント配線板
Abstract:
(EN) This resin composition comprises an epoxy resin and a hardener, the hardener including a styrene-maleic anhydride copolymer (SMA) and an acid anhydride having only one acid anhydride group in a molecule. The acid value of the SMA is 300 to 500 inclusive, the ratio of the equivalent number of the acid anhydride group in the acid anhydride to the equivalent number of the epoxy group in the epoxy resin is 0.05 to 0.5 inclusive, and the ratio of the sum of the equivalent numbers of the acid anhydride group in the acid anhydride and the SMA to the equivalent number of the epoxy group is 0.5 to 1.2 inclusive.
(FR) L'invention concerne une composition de résine qui comprend une résine époxyde et un durcisseur, le durcisseur comprenant un copolymère de styrène-anhydride maléique (SMA) et un anhydride d'acide ayant seulement un groupe anhydride d'acide dans une molécule. L'indice d'acide du SMA est de 300 à 500 inclus, le rapport du nombre d'équivalents du groupe anhydride d'acide dans l'anhydride acide au nombre d'équivalents du groupe époxy dans la résine époxyde est de 0,05 à 0,5 inclus et le rapport de la somme des nombres d'équivalents du groupe anhydride d'acide dans l'anhydride d'acide et le SMA au nombre d'équivalents du groupe époxy est de 0,5 à 1,2 inclus.
(JA) 本発明の樹脂組成物は、エポキシ樹脂と硬化剤とを有し、硬化剤は、スチレン-無水マレイン酸共重合体(SMA)と分子中に酸無水物基を一つだけ有した酸無水物とを含み、SMAの酸価が300以上、550以下であり、エポキシ樹脂におけるエポキシ基の当量数に対する、酸無水物における酸無水物基の当量数の比が0.05以上、0.5以下であり、エポキシ基の当量数に対する、酸無水物とSMAとの酸無水物基の当量数の合計の比が0.5以上、1.2以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)