Search International and National Patent Collections

1. (WO2016063459) SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Pub. No.:    WO/2016/063459    International Application No.:    PCT/JP2015/004955
Publication Date: Fri Apr 29 01:59:59 CEST 2016 International Filing Date: Wed Sep 30 01:59:59 CEST 2015
IPC: H01L 21/822
H01L 21/3205
H01L 21/768
H01L 21/82
H01L 23/522
H01L 27/04
Applicants: SOCIONEXT INC.
株式会社ソシオネクスト
Inventors: MATSUI, Tooru
松井 徹
Title: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Abstract:
The objective of the invention is to provide, for semiconductor integrated circuit devices, a structure that can ensure an ESD protection capability for the core power supply without causing increase of the circuit area. A first pad column (20A) in a core region (2) includes a first core power supply pad (22) that is connected to a core power supply wire and externally supplied with a power supply potential or a ground potential. A pad column (20C) on the outside of the pad column (20A) includes a second core power supply pad (26) that is externally supplied with the power supply potential or ground potential common to the first core power supply pad (22) and that is connected to a core power supply I/O cell (14).