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1. (WO2016062303) METHOD FOR MACHINING AN ELECTRICALLY NON-CONDUCTIVE OR SEMI-CONDUCTIVE MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/062303 International Application No.: PCT/DE2015/100434
Publication Date: 28.04.2016 International Filing Date: 20.10.2015
IPC:
C03B 33/02 (2006.01) ,B23K 26/14 (2006.01) ,B23K 26/38 (2014.01) ,C03B 23/20 (2006.01) ,B23K 26/064 (2014.01) ,B23K 26/0622 (2014.01) ,B23K 103/00 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
02
Cutting or splitting sheet glass; Apparatus or machines therefor
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
14
using a flow, e.g. a jet of gas, in conjunction with the laser beam
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
23
Re-forming shaped glass
20
Uniting glass pieces by fusing without substantial reshaping
[IPC code unknown for B23K 26/064][IPC code unknown for B23K 26/0622]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
Applicants: 4JET MICROTECH GMBH & CO. KG; Konrad-Zuse-Straße 1 52477 Alsdorf, DE
Inventors: STUTE, Uwe; DE
MOALEM, Anas; DE
Agent: GILLE HRABAL PATENT ATTORNEYS; Brucknerstr. 20 40593 Düsseldorf, DE
Priority Data:
10 2014 015 951.520.10.2014DE
Title (EN) METHOD FOR MACHINING AN ELECTRICALLY NON-CONDUCTIVE OR SEMI-CONDUCTIVE MATERIAL
(FR) PROCÉDÉ D'USINAGE D'UN MATÉRIAU ÉLECTRIQUEMENT NON CONDUCTEUR OU SEMI-CONDUCTEUR
(DE) VERFAHREN ZUM BEARBEITEN EINES ELEKTRISCH NICHT LEITENDEN ODER HALBLEITENDEN MATERIALS
Abstract:
(EN) The invention relates to a method for machining an electrically non-conductive or semi-conductive material which is transparent to electromagnetic radiation of at least one transparency wavelength, wherein in the method the material to be machined is irradiated with pulsed laser radiation which has a radiation wavelength that corresponds to the transparency wavelength, and wherein the material to be machined is subjected to an electrical and/or magnetic auxiliary field.
(FR) L'invention concerne un procédé d'usinage d'un matériau électriquement non conducteur ou semi-conducteur, qui est transparent au rayonnement électromagnétique d'au moins une longueur d'ondes de transparence. Ledit procédé consiste à irradier le matériau à usiner avec un rayon laser pulsé, ayant une longueur d'ondes de rayonnement correspondant à la longueur d'ondes de transparence, et à soumettre le matériau à usiner à un champ additionnel électrique et/ou magnétique.
(DE) Die Erfindung betrifft ein Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials, das für elektromagnetische Strahlung zumindest einer Transparenzwellenlänge transparent ist, wobei bei dem Verfahren das zu bearbeitende Material mit gepulster Laserstrahlung bestrahlt wird, die eine Strahlungswellenlänge aufweist, die der Transparenzwellenlänge entspricht, und das zu bearbeitende Material mit einem elektrischen und/oder magnetischen Zusatzfeld beaufschlagt wird.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)