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1. (WO2016060712) CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/060712 International Application No.: PCT/US2015/027473
Publication Date: 21.04.2016 International Filing Date: 24.04.2015
IPC:
H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
BAJAJ, Rajeev; US
KRISHNAN, Kasiraman; US
ORILALL, Mahendra C.; US
REDFIELD, Daniel; US
REDEKER, Fred C.; US
PATIBANDLA, Nag B.; US
MENK, Gregory E.; US
FUNG, Jason G.; US
PERRY, Russell Edward; US
DAVENPORT, Robert E.; US
Agent:
PATTERSON, B. Todd; US
Priority Data:
62/065,19317.10.2014US
62/065,27017.10.2014US
Title (EN) CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES
(FR) CONSTRUCTION DE TAMPON CMP À PROPRIÉTÉS DE MATÉRIAU COMPOSITE AU MOYEN DE PROCESSUS DE FABRICATION ADDITIVE
Abstract:
(EN) Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
(FR) Selon des modes de réalisation, l'invention concerne, d'une manière générale, des tampons de polissage qui comprennent un corps de tampon composite, et des procédés de formation des tampons de polissage. Un mode de réalisation porte sur un tampon de polissage comprenant un corps de tampon composite. Le corps de tampon composite comprend un ou plusieurs premiers éléments formés à partir d'un premier matériau ou d'une première composition de matériaux, et un ou plusieurs seconds éléments formés à partir d'un second matériau ou d'une seconde composition de matériaux, le ou les premiers éléments et le ou les seconds éléments étant formés par dépôt d'une pluralité de couches comprenant le premier matériau ou première composition de matériaux et le second matériau ou seconde composition de matériaux.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)