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Machine translation
1. (WO2016060323) METHOD FOR PREPARING SOLDER RESIST TO WHICH POLYMER BALL COATED WITH ALUMINUM NITRIDE IS ADDED
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/060323    International Application No.:    PCT/KR2014/011177
Publication Date: 21.04.2016 International Filing Date: 20.11.2014
IPC:
H05K 3/28 (2006.01)
Applicants: AN, Woo Young [KR/KR]; (KR)
Inventors: AN, Woo Young; (KR)
Agent: DAE YEON PATENT & LAW FIRM; (306ho, E&C INNOBIZ TOWER, Sindang-dong) 559, Dalseo-daero, Dalseo-gu Daegu 704-919 (KR)
Priority Data:
10-2014-0137744 13.10.2014 KR
Title (EN) METHOD FOR PREPARING SOLDER RESIST TO WHICH POLYMER BALL COATED WITH ALUMINUM NITRIDE IS ADDED
(FR) PROCÉDÉ DE PRÉPARATION D'UNE ÉPARGNE DE SOUDAGE À LAQUELLE DES BILLES DE POLYMÈRE REVÊTUES DE NITRURE D'ALUMINIUM SONT AJOUTÉES
(KO) 질화알미늄이 코팅된 고분자 볼을 첨가한 솔더 레지스터의 제조방법
Abstract: front page image
(EN)The present invention is a method for preparing a solder resist to be applied on a printed circuit board, and according to the present invention, the method for preparing a solder resist to which a polymer ball coated with aluminum nitride is added comprises the steps of: depositing aluminum nitride on the surface of the polymer ball by sputtering so as to form a filler; and dispersing the filler onto solder resist ink, wherein the step of depositing AIN on the surface of the polymer ball by sputtering comprises the steps of: preparing the polymer ball; pre-treating the polymer ball; and forming an AIN film on the outer cover of the polymer ball by a sputtering process in a vacuum chamber.
(FR)La présente invention concerne un procédé de préparation d'une épargne de soudage destinée à être appliquée sur une carte de circuit imprimé, et selon la présente invention, le procédé de préparation d'une épargne de soudage à laquelle des billes de polymère revêtues de nitrure d'aluminium sont ajoutées comprend les étapes consistant : à déposer du nitrure d'aluminium (AlN) sur la surface de billes de polymère par pulvérisation cathodique de manière à former une charge ; et à disperser la charge dans une encre d'épargne de soudage, l'étape de dépôt d'AlN sur la surface des billes de polymère par pulvérisation cathodique comprenant les étapes consistant : à préparer les billes de polymère ; à pré-traiter les billes de polymère ; et à former un film d'AlN sur la surface extérieure des billes de polymère par un processus de pulvérisation cathodique dans une chambre à vide.
(KO)본 발명은 인쇄회로기판에 도포되는 솔더 레지스터를 제조하는 방법이며, 본 발명에 따른 질화알미늄이 코팅된 고분자 볼을 첨가한 솔더 레지스터의 제조방법은 고분자 볼의 표면에 스퍼터링으로 질화알미늄을 증착하여 필러를 형성하는 단계와, 상기 필러를 솔더 레지스터 잉크에 분산시키는 단계로 이루어진다. 여기서, 고분자 볼의 표면에 스퍼터링으로 AIN을 증착하는 단계는 고분자 볼을 준비하는 단계와, 고분자 볼을 전처리하는 단계와, 진공 챔버 내에서 스퍼터링 공정으로 고분자 볼의 외피에 AIN 피막을 형성하는 단계를 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)