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1. (WO2016060073) COMPOSITE DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/060073 International Application No.: PCT/JP2015/078717
Publication Date: 21.04.2016 International Filing Date: 09.10.2015
IPC:
H05K 3/46 (2006.01) ,G06K 19/077 (2006.01) ,H01L 23/14 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01Q 1/38 (2006.01) ,H04B 1/59 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
59
Responders; Transponders
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
加藤登 KATO, Noboru; JP
Agent:
特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE; 大阪府大阪市中央区農人橋1丁目4番34号 1-4-34, Noninbashi, Chuo-ku, Osaka-shi, Osaka 5400011, JP
Priority Data:
2014-21150216.10.2014JP
Title (EN) COMPOSITE DEVICE
(FR) DISPOSITIF COMPOSITE
(JA) 複合デバイス
Abstract:
(EN) This composite device (101) is provided with a substrate (10) and a mounted component (20) that is mounted inside or on the surface of the substrate (10). The substrate (10) comprises a first thermoplastic resin layer, while the mounted component (20) comprises, on the surface thereof, at least a second thermoplastic resin layer that is formed from the same material as the first thermoplastic resin layer. A bonding layer (30) for the second thermoplastic resin layer and the first thermoplastic resin layer is formed between the second thermoplastic resin layer and the first thermoplastic resin layer.
(FR) La présente invention concerne un dispositif composite (101) muni d'un substrat (10) et d'un composant monté (20) qui est monté à l'intérieur ou sur la surface du substrat (10). Le substrat (10) comporte une première couche de résine thermoplastique, tandis que le composant monté (20) comporte, sur sa surface, au moins une deuxième couche de résine thermoplastique qui est formée du même matériau que la première couche de résine thermoplastique. Une couche (30) de liaison pour la deuxième couche de résine thermoplastique et la première couche de résine thermoplastique est formée entre la deuxième couche de résine thermoplastique et la première couche de résine thermoplastique.
(JA)  複合デバイス(101)は、基板(10)と、基板(10)の表面または内部に実装される実装部品(20)とを備える。基板(10)は第1の熱可塑性樹脂層を有し、実装部品(20)は、表面に、第1の熱可塑性樹脂層と同種材料の少なくとも第2の熱可塑性樹脂層を有し、第2の熱可塑性樹脂層と第1の熱可塑性樹脂層との間に、第2の熱可塑性樹脂と第1の熱可塑性樹脂との接合層(30)が形成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)