Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2016060069) SEMICONDUCTOR LASER DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/060069 International Application No.: PCT/JP2015/078690
Publication Date: 21.04.2016 International Filing Date: 08.10.2015
IPC:
H01S 5/022 (2006.01) ,H01S 5/024 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
024
Cooling arrangements
Applicants:
株式会社小糸製作所 KOITO MANUFACTURING CO., LTD. [JP/JP]; 東京都港区高輪4丁目8番3号 8-3, Takanawa 4-chome, Minato-ku, Tokyo 1088711, JP
Inventors:
柴田 裕一 SHIBATA Yuichi; JP
望月 光之 MOCHIZUKI Mitsuyuki; JP
達川 正士 TATSUKAWA Masashi; JP
Agent:
特許業務法人 信栄特許事務所 SHIN-EI PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング8階 Toranomon East Bldg. 8F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2014-21099615.10.2014JP
Title (EN) SEMICONDUCTOR LASER DEVICE
(FR) DISPOSITIF LASER SEMICONDUCTEUR
(JA) 半導体レーザー装置
Abstract:
(EN) Provided is a semiconductor laser device having enhanced heat dissipation properties. A semiconductor laser device 10 comprises a stem 11, a cap 12 that is attached to the upper surface of the stem 11, a semiconductor laser element 13, and a feeding member 14 which is at least partially buried in the stem 11. The feeding member 14 comprises an element-side terminal 32 that is electrically connected to the semiconductor laser element 13, and an external terminal 33. The external terminal 33 of the feeding member 14 is exposed in the lateral surface or the upper surface of the stem 11, and the lower surface of the stem 11 is provided with a fitting surface 11b that is fitted to a mounting object.
(FR) L'invention concerne un dispositif laser semiconducteur possédant des propriétés de dissipation de chaleur améliorées. Un dispositif laser semiconducteur (10) comprend une tige (11), un capuchon (12) qui est fixé à la surface supérieure de la tige (11), un élément laser semiconducteur (13) et un élément d'alimentation (14) qui est au moins partiellement noyé dans la tige (11). L'élément d'alimentation (14) comprend une borne côté élément (32) qui est reliée électriquement à l'élément laser semiconducteur (13) et une borne externe (33). La borne externe (33) de l'élément d'alimentation (14) est exposée dans la surface latérale ou la surface supérieure de la tige (11) et la surface inférieure de la tige (11) est pourvue d'une surface de montage (11b) qui est montée sur un objet de fixation.
(JA)  放熱性が高められた半導体レーザー装置を提供する。半導体レーザー装置10は、ステム11と、ステム11の上面に取り付けられたキャップ12と、半導体レーザー素子13と、少なくとも一部がステム11に埋設された給電部材14を有する。給電部材14は、半導体レーザー素子13に電気的に接続された素子側端子32と、外部端子33と、を有する。ステム11の側面または上面に給電部材14の外部端子33が露出され、ステム11の下面に搭載対象に取り付けられる取付面11bが設けられている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)