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1. (WO2016059799) COOLING SYSTEM AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/059799 International Application No.: PCT/JP2015/005203
Publication Date: 21.04.2016 International Filing Date: 14.10.2015
IPC:
F28D 15/02 (2006.01) ,H01L 23/427 (2006.01) ,H05K 7/20 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
D
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15
Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02
in which the medium condenses and evaporates, e.g. heat-pipes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427
Cooling by change of state, e.g. use of heat pipes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants: NEC PLATFORMS, LTD.[JP/JP]; 2-6-1, Kitamikata, Takatsu-ku, Kawasaki-shi, Kanagawa 2138511, JP
Inventors: FUJII, Shunsuke; JP
Agent: SHIMOSAKA, Naoki; JP
Priority Data:
2014-21215317.10.2014JP
Title (EN) COOLING SYSTEM AND ELECTRONIC DEVICE
(FR) SYSTÈME DE REFROIDISSEMENT ET DISPOSITIF ÉLECTRONIQUE
(JA) 冷却システム及び電子装置
Abstract:
(EN) The purpose of the present invention is to more efficiently cool exhaust heat, of an apparatus or the like that emits heat, by preventing a situation where a gas-phase medium is cooled and turns into a liquid-phase medium and thereby transfer of the gas-phase medium is hindered. For this purpose, a cooling system includes a heat receiving means for receiving a gas heated by heat emitted by an electronic apparatus and changing a liquid-phase heat medium into a gas-phase heat medium, a heat radiation means for cooling the gas-phase heat medium so as to be changed into the liquid-phase heat medium, a first transfer means for transferring the gas-phase heat medium from the heat receiving means to the heat radiation means, and a second transfer means for transferring the liquid-phase heat medium from the heat radiation means to the heat receiving means, wherein at least part of the first transfer means is heated by the heat emitted by the electronic apparatus.
(FR) L'objectif de la présente invention est de refroidir plus efficacement la chaleur d'échappement, d'un appareil ou similaire qui émet de la chaleur, en empêchant une situation où un milieu en phase gazeuse est refroidi et se transforme en milieu en phase liquide, ce qui fait que le transfert du milieu en phase gazeuse est entravé. Dans ce but, un système de refroidissement comprend un moyen de réception thermique permettant de recevoir un gaz chauffé par la chaleur émise par un appareil électronique et de transformer un milieu thermique en phase liquide en un milieu thermique en phase gazeuse, un moyen de rayonnement thermique destiné à refroidir le milieu thermique en phase gazeuse de façon à ce qu'il soit transformé en milieu thermique en phase liquide, un premier moyen de transfert permettant de transférer le milieu thermique en phase gazeuse du moyen de réception thermique au moyen de rayonnement thermique, et un second moyen de transfert pour transférer le milieu thermique en phase liquide du moyen de rayonnement thermique au moyen de réception thermique, au moins une partie du premier moyen de transfert étant chauffée par la chaleur émise par l'appareil électronique.
(JA)  気相媒体が冷えて液相媒体になることにより、気相媒体の移送が妨げられることを防ぎ、熱を発する機器等の排熱を一層効率的に冷却することのできるようにすることを目的とする。そのために、電子機器が発する熱により暖められた気体を受け、液相の熱媒体を気相の熱媒体に変化させる受熱手段と、前記気相の熱媒体を冷却し前記液相の熱媒体に変化させる放熱手段と、前記気相の熱媒体を前記受熱手段から前記放熱手段に移送する第一移送手段と、前記液相の熱媒体を前記放熱手段から前記受熱手段に移送する第二移送手段とを備える冷却システムにおいて、前記第一移送手段の少なくとも一部を前記電子機器が発する熱を用いて加熱する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)